HiSilicon Kirin 810

HiSilicon Kirin 810

HiSilicon Kirin 810
General information
Marketed by	Huawei/HiSilicon
Announced	June 2019
Manufactured by	TSMC N7 ("7 nm")
Specifications
CPU(s)	8 2x ARM Cortex-A76 @ 2.27 GHz 6x ARM Cortex-A55 @ 1.9 GHz
GPU	6x ARM Mali-G52
NPU	Huawei Da Vinci
ISP	HiSilicon Kirin ISP 4.0
RAM	LPDDR4X-4266
Modem	4G
Architecture and classification
Application	Intermediate mobile
Process node	7 nm
Architecture	ARM
Instruction set	ARMv8.2-A (64-bit)
Identification
Marketing name(s)	Kirin 810
Core name(s)	ARM Cortex-A76 ARM Cortex-A55
History
Predecessor	HiSilicon Kirin 710
Successor	HiSilicon Kirin 825

HiSilicon Kirin 810 is an intermediate mobile processor from Huawei/HiSilicon, announced in June, 2019.

Devices

• Huawei Nova 5
• Huawei Honor 9x
• Huawei Honor 9x Pro
• Huawei Mate 30 Lite
• Huawei P40 Lite
• Huawei Nova 7i
• Huawei nova 6 SE
• Huawei P smart Pro 2019
• Huawei nova 5z
• Huawei nova 5i Pro
• Huawei Honor 20S

References

HiSilicon processors [e]
Premium	Kirin 910 910T 920 925 928 930 935 950 955 960 970 980 990 9000E 9000 9000s
Intermediate	Kirin 710 810 820E 820 985
Basic	Kirin 620 650 655 658 659
Latest processors
Qualcomm Snapdragon 8s Gen 3 (2024/Mar) Qualcomm Snapdragon X Elite gen 1 (2023/Oct) Qualcomm Snapdragon 8 Gen 3 (2023/Oct) Qualcomm Snapdragon 7 Gen 3 (2023/Oct) Qualcomm Snapdragon 7s Gen 2 (2023/Sep) Apple A17 (2023/Sep) HiSilicon Kirin 9000s (2023/Aug) Apple M2 Ultra (2023/Jun) MediaTek Dimensity 7050 (2023/May) Qualcomm Snapdragon 7+ Gen 2 (2023/Mar) Samsung Exynos 1380 (2023/Feb) Samsung Exynos 1330 (2023/Feb) MediaTek Dimensity 7200 (2023/Feb) Apple M2 Pro (2023/Jan) Apple M2 Max (2023/Jan) MediaTek Dimensity 8200 (2022/Dec) Qualcomm Snapdragon 782G (2022/Nov) MediaTek Dimensity 9200 (2022/Nov) Google Tensor G2 (2022/Oct) MediaTek Dimensity 1080 (2022/Oct) [e]