HiSilicon Kirin 820

HiSilicon Kirin 820
	HiSilicon Kirin 820
General information
Marketed by	Huawei/HiSilicon
Announced	May 2020
Manufactured by	TSMC N7 ("7 nm");
Specifications
CPU(s)	8; 1x ARM Cortex-A76 @ 2.36 GHz; 3x ARM Cortex-A76 @ 2.22 GHz; 4x ARM Cortex-A55 @ 1.84 GHz;
GPU	6x ARM Mali-G57
NPU	Huawei Da Vinci
ISP	HiSilicon Kirin ISP 5.0
RAM	LPDDR4X-4266
Modem	5G;
Architecture and classification
Application	Intermediate mobile
Process node	7 nm
Architecture	ARM
Instruction set	ARMv8.2-A (64-bit)
Identification
Marketing name(s)	Kirin 820;
Variant(s)	HiSilicon Kirin 820E
Core name(s)	ARM Cortex-A76; ARM Cortex-A55;
History
Predecessor	HiSilicon Kirin 810
Successor	HiSilicon Kirin 985

HiSilicon Kirin 820 is an intermediate mobile processor from Huawei/HiSilicon, announced in May, 2020.

Devices

HiSilicon processors [e]
Premium	Kirin 910 910T 920 925 928 930 935 950 955 960 970 980 990 9000E 9000 9000s
Intermediate	Kirin 710 810 820E 820 985
Basic	Kirin 620 650 655 658 659
Latest processors
MediaTek Dimensity 9400 (2024/Oct) Apple A18 Pro (2024/Sep) Apple A18 (2024/Sep) Qualcomm Snapdragon 8s Gen 3 (2024/Mar) Qualcomm Snapdragon X Elite gen 1 (2023/Oct) Qualcomm Snapdragon 8 Gen 3 (2023/Oct) Qualcomm Snapdragon 7 Gen 3 (2023/Oct) Qualcomm Snapdragon 7s Gen 2 (2023/Sep) Apple A17 (2023/Sep) HiSilicon Kirin 9000s (2023/Aug) Apple M2 Ultra (2023/Jun) MediaTek Dimensity 7050 (2023/May) Qualcomm Snapdragon 7+ Gen 2 (2023/Mar) Samsung Exynos 1380 (2023/Feb) Samsung Exynos 1330 (2023/Feb) MediaTek Dimensity 7200 (2023/Feb) Apple M2 Pro (2023/Jan) Apple M2 Max (2023/Jan) MediaTek Dimensity 8200 (2022/Dec) Qualcomm Snapdragon 782G (2022/Nov) [e]