HiSilicon Kirin 990

HiSilicon Kirin 990
	HiSilicon Kirin 990
General information
Marketed by	Huawei/HiSilicon
Announced	September 2019
Manufactured by	TSMC N7+ ("7 nm") (999 5G); TSMC N7 ("7 nm") (999 4G);
Specifications
Transistors	10.3 billion (990 5G); 8 billion (990 4G);
CPU(s)	8; 1x ARM Cortex-A76 @ 2.86 GHz; 3x ARM Cortex-A76 @ 2.36 GHz; (2.09 @ 990 4G); 4x ARM Cortex-A55 @ 1.95 GHz;
GPU	16x ARM Mali-G76; 14x ARM Mali-G76 (990E 5G)
NPU	Huawei DaVinci 1.0
ISP	HiSilicon Kirin ISP 5.0
RAM	LPDDR4X-4266
Storage	UFS 3.0
Modem	5G;
Architecture and classification
Application	Premium mobile
Process node	7 nm
Architecture	ARM
Instruction set	ARMv8.2-A (64-bit)
Identification
Marketing name(s)	Kirin 990 4G; Kirin 990 5G; Kirin 990E 5G;
Core name(s)	ARM Cortex-A76; ARM Cortex-A55;
History
Predecessor	HiSilicon Kirin 980
Successor	HiSilicon Kirin 9000

HiSilicon Kirin 990 is a premium mobile processor from Huawei/HiSilicon, announced in September, 2019.

Devices

HiSilicon processors [e]
Premium	Kirin 910 910T 920 925 928 930 935 950 955 960 970 980 990 9000E 9000 9000s
Intermediate	Kirin 710 810 820E 820 985
Basic	Kirin 620 650 655 658 659
Latest processors
MediaTek Dimensity 9400 (2024/Oct) Apple A18 Pro (2024/Sep) Apple A18 (2024/Sep) Qualcomm Snapdragon 8s Gen 3 (2024/Mar) Qualcomm Snapdragon X Elite gen 1 (2023/Oct) Qualcomm Snapdragon 8 Gen 3 (2023/Oct) Qualcomm Snapdragon 7 Gen 3 (2023/Oct) Qualcomm Snapdragon 7s Gen 2 (2023/Sep) Apple A17 (2023/Sep) HiSilicon Kirin 9000s (2023/Aug) Apple M2 Ultra (2023/Jun) MediaTek Dimensity 7050 (2023/May) Qualcomm Snapdragon 7+ Gen 2 (2023/Mar) Samsung Exynos 1380 (2023/Feb) Samsung Exynos 1330 (2023/Feb) MediaTek Dimensity 7200 (2023/Feb) Apple M2 Pro (2023/Jan) Apple M2 Max (2023/Jan) MediaTek Dimensity 8200 (2022/Dec) Qualcomm Snapdragon 782G (2022/Nov) [e]