HiSilicon Kirin 970

HiSilicon Kirin 970

HiSilicon Kirin 970
General information
Marketed by	Huawei/HiSilicon
Announced	September 2017
Manufactured by	TSMC 10FF ("10 nm")
Specifications
Transistors	5.5 billion
CPU(s)	8 4x ARM Cortex-A73 @ 2.36 GHz 4x ARM Cortex-A53 @ 1.84 GHz
GPU	12x ARM Mali-G72
NPU	1x Cambricon
ISP	HiSilicon Kirin ISP 4.0
RAM	LPDDR4x-3666
Storage	UFS 2.1
Modem	4G
Architecture and classification
Application	Premium mobile
Process node	10 nm
Architecture	ARM
Instruction set	ARMv8-A (64-bit)
Identification
Marketing name(s)	Kirin 970
Core name(s)	ARM Cortex-A73 ARM Cortex-A53
History
Predecessor	HiSilicon Kirin 960
Successor	HiSilicon Kirin 980

HiSilicon Kirin 970 is a premium mobile processor from Huawei/HiSilicon, announced in September, 2017.

Devices

• Huawei Nova 3
• Huawei P20
• Huawei P20 Pro
• Huawei Mate 10
• Huawei Mate 10 Pro
• Huawei Mate 10 Porsche Design
• Huawei Mate RS Porsche Design
• Honor V10/ Honor View 10
• Honor 10
• Honor Note 10
• Honor Play

References

HiSilicon processors [e]
Premium	Kirin 910 910T 920 925 928 930 935 950 955 960 970 980 990 9000E 9000 9000s
Intermediate	Kirin 710 810 820E 820 985
Basic	Kirin 620 650 655 658 659
Latest processors
Qualcomm Snapdragon 8s Gen 3 (2024/Mar) Qualcomm Snapdragon X Elite gen 1 (2023/Oct) Qualcomm Snapdragon 8 Gen 3 (2023/Oct) Qualcomm Snapdragon 7 Gen 3 (2023/Oct) Qualcomm Snapdragon 7s Gen 2 (2023/Sep) Apple A17 (2023/Sep) HiSilicon Kirin 9000s (2023/Aug) Apple M2 Ultra (2023/Jun) MediaTek Dimensity 7050 (2023/May) Qualcomm Snapdragon 7+ Gen 2 (2023/Mar) Samsung Exynos 1380 (2023/Feb) Samsung Exynos 1330 (2023/Feb) MediaTek Dimensity 7200 (2023/Feb) Apple M2 Pro (2023/Jan) Apple M2 Max (2023/Jan) MediaTek Dimensity 8200 (2022/Dec) Qualcomm Snapdragon 782G (2022/Nov) MediaTek Dimensity 9200 (2022/Nov) Google Tensor G2 (2022/Oct) MediaTek Dimensity 1080 (2022/Oct) [e]