HiSilicon Kirin 925

HiSilicon Kirin 925
	HiSilicon Kirin 925
General information
Marketed by	Huawei/HiSilicon
Announced	September 2014
Manufactured by	TSMC 28 HPM ("28 nm");
Specifications
CPU(s)	8; 4x ARM Cortex-A15 @ 1.8 GHz; 4x ARM Cortex-A7 @ 1.3 GHz;
GPU	4x ARM Mali-T628
ISP	HiSilicon Kirin ISP
RAM	LPDDR3-3200
Storage	eMMC
Modem	4G;
Architecture and classification
Application	Premium mobile
Process node	28 nm
Architecture	ARM
Instruction set	ARMv7 (32-bit)
Identification
Marketing name(s)	Kirin 925;
Variant(s)	HiSilicon Kirin 920; HiSilicon Kirin 928
Core name(s)	ARM Cortex-A15; ARM Cortex-A7;
History
Predecessor	HiSilicon Kirin 920
Successor	HiSilicon Kirin 928

HiSilicon Kirin 925 is a premium mobile processor from Huawei/HiSilicon, announced in September, 2014.

Devices

HiSilicon processors [e]
Premium	Kirin 910 910T 920 925 928 930 935 950 955 960 970 980 990 9000E 9000 9000s
Intermediate	Kirin 710 810 820E 820 985
Basic	Kirin 620 650 655 658 659
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MediaTek Dimensity 9400 (2024/Oct) Apple A18 Pro (2024/Sep) Apple A18 (2024/Sep) Qualcomm Snapdragon 8s Gen 3 (2024/Mar) Qualcomm Snapdragon X Elite gen 1 (2023/Oct) Qualcomm Snapdragon 8 Gen 3 (2023/Oct) Qualcomm Snapdragon 7 Gen 3 (2023/Oct) Qualcomm Snapdragon 7s Gen 2 (2023/Sep) Apple A17 (2023/Sep) HiSilicon Kirin 9000s (2023/Aug) Apple M2 Ultra (2023/Jun) MediaTek Dimensity 7050 (2023/May) Qualcomm Snapdragon 7+ Gen 2 (2023/Mar) Samsung Exynos 1380 (2023/Feb) Samsung Exynos 1330 (2023/Feb) MediaTek Dimensity 7200 (2023/Feb) Apple M2 Pro (2023/Jan) Apple M2 Max (2023/Jan) MediaTek Dimensity 8200 (2022/Dec) Qualcomm Snapdragon 782G (2022/Nov) [e]