HiSilicon Kirin 9000

HiSilicon Kirin 9000

HiSilicon Kirin 9000
General information
Marketed by	Huawei/HiSilicon
Announced	October 2020
Manufactured by	TSMC N5 ("5 nm")
Specifications
Transistors	15.3 billion
CPU(s)	8 1x ARM Cortex-A77 @ 3.13 GHz 3x ARM Cortex-A77 @ 2.56 GHz 4x ARM Cortex-A55 @ 2.05 GHz
GPU	24x ARM Mali-G78
RAM	LPDDR5-5500, LPDDR4X-4266
Modem	5G
Architecture and classification
Application	Premium mobile
Process node	5 nm
Architecture	ARM
Instruction set	ARMv8.2-A (64-bit)
Identification
Marketing name(s)	Kirin 9000
Variant(s)	HiSilicon Kirin 9000E HiSilicon Kirin 9000s
Core name(s)	ARM Cortex-A77 ARM Cortex-A55
History
Predecessor	HiSilicon Kirin 990
Successor	HiSilicon Kirin 9000s

HiSilicon Kirin 9000 is a premium mobile processor from Huawei/HiSilicon, announced in October 22, 2020.

Devices

• Huawei Mate 40 Pro+ (2020/oct)
• Huawei Mate 40 Pro (2020/oct)
• Porsche Design Huawei Mate 40 RS (2020/oct)
• Huawei Mate X2 (2021/feb)

References

HiSilicon processors [e]
Premium	Kirin 910 910T 920 925 928 930 935 950 955 960 970 980 990 9000E 9000 9000s
Intermediate	Kirin 710 810 820E 820 985
Basic	Kirin 620 650 655 658 659
Latest processors
MediaTek Dimensity 8400 (2024/Dec) Qualcomm Snapdragon 8 Elite (2024/Oct) MediaTek Dimensity 9400 (2024/Oct) Apple A18 Pro (2024/Sep) Apple A18 (2024/Sep) Qualcomm Snapdragon 8s Gen 3 (2024/Mar) Qualcomm Snapdragon X Elite gen 1 (2023/Oct) Qualcomm Snapdragon 8 Gen 3 (2023/Oct) Qualcomm Snapdragon 7 Gen 3 (2023/Oct) Qualcomm Snapdragon 7s Gen 2 (2023/Sep) Apple A17 (2023/Sep) HiSilicon Kirin 9000s (2023/Aug) Apple M2 Ultra (2023/Jun) MediaTek Dimensity 7050 (2023/May) Qualcomm Snapdragon 7+ Gen 2 (2023/Mar) Samsung Exynos 1380 (2023/Feb) Samsung Exynos 1330 (2023/Feb) MediaTek Dimensity 7200 (2023/Feb) Apple M2 Pro (2023/Jan) Apple M2 Max (2023/Jan) [e]