HiSilicon Kirin 710

HiSilicon Kirin 710

HiSilicon Kirin 710
General information
Marketed by	Huawei/HiSilicon
Announced	July 2018 May 2020 (710A)
Manufactured by	TSMC 12FF ("12 nm") SMIC 14 FinFET ("14 nm")
Specifications
CPU(s)	8 4x ARM Cortex-A73 @ 2.2 GHz (2.0 @ 710A) 4x ARM Cortex-A53 @ 1.7 GHz
GPU	4x ARM Mali-G51
RAM	LPDDR4
Modem	4G
Architecture and classification
Application	Intermediate mobile
Process node	12 nm to 14 nm
Architecture	ARM
Instruction set	ARMv8.2-A (64-bit)
Identification
Marketing name(s)	Kirin 710 Kirin 710A Kirin 710F
Core name(s)	ARM Cortex-A73 ARM Cortex-A53
History
Predecessor	HiSilicon Kirin 659
Successor	HiSilicon Kirin 810

HiSilicon Kirin 710 is an intermediate mobile processor from Huawei/HiSilicon, announced in July, 2018.

Devices

Kirin 710

• Huawei Nova 3i
• Honor 10 Lite
• Huawei P Smart+
• Huawei P Smart 2019
• Huawei Mate 20 Lite
• Honor 8X
• Huawei Y9 (2019),
• Huawei Y9 Prime 2019
• Huawei Y9s
• Huawei Mate 20 Lite
• Huawei P30 Lite
• Honor 20i

Kirin 710F

• Honor 9X
• Huawei P40 lite E
• Huawei Y8p

Kirin 710A

• Honor Play 4T
• Huawei P smart 2021

References

HiSilicon processors [e]
Premium	Kirin 910 910T 920 925 928 930 935 950 955 960 970 980 990 9000E 9000 9000s
Intermediate	Kirin 710 810 820E 820 985
Basic	Kirin 620 650 655 658 659
Latest processors
Qualcomm Snapdragon 8s Gen 3 (2024/Mar) Qualcomm Snapdragon X Elite gen 1 (2023/Oct) Qualcomm Snapdragon 8 Gen 3 (2023/Oct) Qualcomm Snapdragon 7 Gen 3 (2023/Oct) Qualcomm Snapdragon 7s Gen 2 (2023/Sep) Apple A17 (2023/Sep) HiSilicon Kirin 9000s (2023/Aug) Apple M2 Ultra (2023/Jun) MediaTek Dimensity 7050 (2023/May) Qualcomm Snapdragon 7+ Gen 2 (2023/Mar) Samsung Exynos 1380 (2023/Feb) Samsung Exynos 1330 (2023/Feb) MediaTek Dimensity 7200 (2023/Feb) Apple M2 Pro (2023/Jan) Apple M2 Max (2023/Jan) MediaTek Dimensity 8200 (2022/Dec) Qualcomm Snapdragon 782G (2022/Nov) MediaTek Dimensity 9200 (2022/Nov) Google Tensor G2 (2022/Oct) MediaTek Dimensity 1080 (2022/Oct) [e]