HiSilicon Kirin 659

HiSilicon Kirin 659
	HiSilicon Kirin 659
General information
Marketed by	Huawei/HiSilicon
Announced	July 2017
Manufactured by	TSMC 16FF+ ("16 nm");
Specifications
CPU(s)	8; 4x ARM Cortex-A53 @ 2.36 GHz; 4x ARM Cortex-A53 @ 1.7 GHz;
GPU	2x ARM Mali-T830
RAM	LPDDR3-1866
Modem	4G;
Architecture and classification
Application	Basic mobile
Process node	16 nm
Architecture	ARM
Instruction set	ARMv8-A (64-bit)
Identification
Marketing name(s)	Kirin 659;
Variant(s)	HiSilicon Kirin 658; HiSilicon Kirin 655; HiSilicon Kirin 650
Core name(s)	ARM Cortex-A53;
History
Predecessor	HiSilicon Kirin 658
Successor	HiSilicon Kirin 710

HiSilicon Kirin 658 is an intermediate mobile processor from Huawei/HiSilicon, announced in July, 2017.

Devices

HiSilicon processors [e]
Premium	Kirin 910 910T 920 925 928 930 935 950 955 960 970 980 990 9000E 9000 9000s
Intermediate	Kirin 710 810 820E 820 985
Basic	Kirin 620 650 655 658 659
Latest processors
MediaTek Dimensity 9400 (2024/Oct) Apple A18 Pro (2024/Sep) Apple A18 (2024/Sep) Qualcomm Snapdragon 8s Gen 3 (2024/Mar) Qualcomm Snapdragon X Elite gen 1 (2023/Oct) Qualcomm Snapdragon 8 Gen 3 (2023/Oct) Qualcomm Snapdragon 7 Gen 3 (2023/Oct) Qualcomm Snapdragon 7s Gen 2 (2023/Sep) Apple A17 (2023/Sep) HiSilicon Kirin 9000s (2023/Aug) Apple M2 Ultra (2023/Jun) MediaTek Dimensity 7050 (2023/May) Qualcomm Snapdragon 7+ Gen 2 (2023/Mar) Samsung Exynos 1380 (2023/Feb) Samsung Exynos 1330 (2023/Feb) MediaTek Dimensity 7200 (2023/Feb) Apple M2 Pro (2023/Jan) Apple M2 Max (2023/Jan) MediaTek Dimensity 8200 (2022/Dec) Qualcomm Snapdragon 782G (2022/Nov) [e]