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Model | CPU[1] | GPU[2] | DSP[3] | ISP[4] | RAM | Modem | Catalog number | Litography | Release date |
---|---|---|---|---|---|---|---|---|---|
HiSilicon Kirin 9000 |
|
24x ARM Mali-G78 |
|
5G | "5 nm" TSMC N5 EUV |
2020/10 | |||
HiSilicon Kirin 9000E |
|
22x ARM Mali-G78 |
|
5G | "5 nm" TSMC N5 EUV |
2020/10 | |||
HiSilicon Kirin 990 5G |
|
16x ARM Mali-G76 @ 600 MHz (737,28 GFLOPS) |
Kirin ISP 5.0 | LPDDR4X Quad-channel 16-bit @ 2133 MHz (34.1 GB/s) |
5G (2300 / 1250 Mbps) |
"7 nm" TSMC N7+ EUV |
2019/09[5] | ||
HiSilicon Kirin 990 4G |
|
16x ARM Mali-G76 @ 600 MHz (737,28 GFLOPS) |
Kirin ISP 5.0 | LPDDR4X Quad-channel 16-bit @ 2133 MHz (34.1 GB/s) |
4G | "7 nm" TSMC N7 DUV |
2019/09[5] | ||
HiSilicon Kirin 980 |
|
10x ARM Mali-G76 @ 720 MHz (489.6 GFLOPS) |
Kirin ISP 4.0 | LPDDR4X Quad-channel 16-bit @ 2133 MHz (34.1 GB/s) |
4G (1400 / 200 mbps) |
"7 nm" TSMC N7 DUV |
2018/08[6] | ||
HiSilicon Kirin 970 |
|
12x ARM Mali-G72 @ 746 MHz (330 GFLOPS) |
Cadence Tensilica Vision P6 | LPDDR4X Quad-channel 16-bit @ 1833 MHz (29.9 GB/s) |
4G (1400 / 150 mbps) |
"10 nm" TSMC 10 FinFET+ |
2017/09[7] | ||
HiSilicon Kirin 960 |
|
8x ARM Mali-G71 @ 1037 MHz (282 GFLOPS) |
LPDDR4 Quad-channel 16-bit @ 1600 MHz (28.8 GB/s) |
4G (600 / 150 mbps) |
"16 nm" TSMC 16FFC |
2016/10[8] | |||
HiSilicon Kirin 955 |
|
4x ARM Mali-T880 @ 900 MHz (122.4 GFLOPS) |
|
4G (300 / 50 mbps) |
"16 nm" TSMC 16FF+ |
2016/04[9] | |||
HiSilicon Kirin 950 |
|
4x ARM Mali-T880 @ 900 MHz (122.4 GFLOPS) |
|
4G (300 / 50 mbps) |
"16 nm" TSMC 16FF+ |
2015/11[10] | |||
HiSilicon Kirin 935 |
|
4x ARM Mali-T628 @ 680 MHz (87 GFLOPS) |
LPDDR3 Dual-channel 32-bit @ 800 MHz (12.8 GB/s) |
4G (300 / 50 mbps) |
"28 nm" TSMC 28HPC |
2015/04[11] | |||
HiSilicon Kirin 930 |
|
4x ARM Mali-T628 @ 600 MHz (76.8 GFLOPS) |
LPDDR3 Dual-channel 32-bit @ 800 MHz (12.8 GB/s) |
4G (300 / 50 mbps) |
"28 nm" TSMC 28HPC |
2015/04[11] | |||
HiSilicon Kirin 928 |
|
4x ARM Mali-T628 @ 600 MHz (76.8 GFLOPS) |
LPDDR3 Dual-channel 32-bit @ 800 MHz (12.8 GB/s) |
4G (300 / 50 mbps) |
"28 nm" TSMC 28HPM |
2014/10[12] | |||
HiSilicon Kirin 925 |
|
4x ARM Mali-T628 @ 600 MHz (76.8 GFLOPS) |
LPDDR3 Dual-channel 32-bit @ 800 MHz (12.8 GB/s) |
4G (300 / 50 mbps) |
"28 nm" TSMC 28HPM |
2014/09[13] | |||
HiSilicon Kirin 920 |
|
4x ARM Mali-T628 @ 600 MHz (76.8 GFLOPS) |
Tensilica HIFI3 | LPDDR3 Dual-channel 32-bit @ 800 MHz (12.8 GB/s) |
4G (300 / 50 mbps) |
"28 nm" TSMC 28HPM |
2014/06[14] | ||
HiSilicon Kirin 910T | 4x ARM Cortex-A9 @ 1.8 GHz | 4x ARM Mali-450 @ 700 MHz (41.8 GFLOPS) |
LPDDR3 single-channel 32-bit @ 800 MHz (6.4 GB/s) |
4G | "28 nm" TSMC 28HPM |
2014/05[15] | |||
HiSilicon Kirin 910 | 4x ARM Cortex-A9 @ 1.6 GHz | 4x ARM Mali-450 @ 533 MHz (32 GFLOPS) |
LPDDR3 single-channel 32-bit @ 800 MHz (6.4 GB/s) |
4G | "28 nm" TSMC 28HPM |
2014/05[15] | |||
Model | CPU | GPU | DSP | ISP | RAM | Modem | Catalog name | Litography | Release date |
Intermediate
Model | CPU[1] | GPU[2] | DSP[3] | ISP[4] | RAM | Modem | Catalog number | Litography | Release date |
---|---|---|---|---|---|---|---|---|---|
HiSilicon Kirin 985 |
|
8x ARM Mali-G77 | Kirin ISP 5.0 | LPDDR4X Quad-channel 16-bit @ 2133 MHz (34.1 GB/s) |
5G | "7 nm" TSMC N7 DUV |
2020/04[16] | ||
HiSilicon Kirin 820 |
|
6x ARM Mali-G57 | Kirin ISP 5.0 | LPDDR4X Quad-channel 16-bit @ 2133 MHz (34.1 GB/s) |
5G | "7 nm" TSMC N7 DUV |
2020/03[17] | ||
HiSilicon Kirin 810 |
|
6x ARM Mali-G52 @ 820 MHz | LPDDR4X Quad-channel 16-bit @ 2133 MHz (34.1 GB/s) |
4G | "7 nm" TSMC N7 DUV |
2019/06[18] | |||
HiSilicon Kirin 710A |
|
4x ARM Mali-G51 @ 1000 MHz | LPDDR4 32-bit | 4G (600 / 150 mbps) |
"14 nm" SMIC 14 FinFET |
2020/05[19] | |||
HiSilicon Kirin 710 |
|
4x ARM Mali-G51 @ 1000 MHz | LPDDR4 32-bit | 4G (600 / 150 mbps) |
"12 nm" TSMC 12 FinFET |
2018/07[20] | |||
Model | CPU | GPU | DSP | ISP | RAM | Modem | Catalog name | Litography | Release date |
References
- ↑ 1.0 1.1 Central Processing Unit.
- ↑ 2.0 2.1 Graphics Processing Unit, responsible for displaying graphics and text on the device screen.
- ↑ 3.0 3.1 Digital Signal Processor, responsible for measuring, filtering and compressing analog signals.
- ↑ 4.0 4.1 Image Signal Processor, responsible for processing the images captured by the camera.
- ↑ 5.0 5.1 Huawei Launches the latest flagship Kirin 990 and its enhanced 5G version
- ↑ Key Information About the Huawei Kirin 980
- ↑ Huawei Reveals the Future of Mobile AI at IFA 2017
- ↑ Huawei announces the HiSilicon Kirin 960: 4xA73 + 4xA53, G71MP8, CDMA
- ↑ New Huawei Flagship Device Combines Groundbreaking Innovations and Exceptional Design, Setting a New Standard in Smartphone Photography
- ↑ HUAWEI Announces the Octa-core Kirin 950 Processor
- ↑ 11.0 11.1 Huawei Announces New P8 And P8 Max
- ↑ Huawei Honor 6 Extreme Edition is official with Kirin 928 chip
- ↑ Huawei Ascend Mate 7 & Ascend G7 Hands-On
- ↑ Octa-core Huawei Kirin 920 chipset goes official
- ↑ 15.0 15.1 Huawei Launches Ascend P7 Based on Custom HiSilicon SoC
- ↑ Huawei Reasserts Itself as a Leader in 5G with the Latest 5G SoC Kirin 985
- ↑ Huawei Launches New-Gen 5G SoC Kirin 820
- ↑ Huawei Announces Nova 5 & Nova Pro in China: Introduces New Kirin 810 Chipset
- ↑ Huawei Kirin 710A chip achieves mass production
- ↑ Kirin 710 Key Messages