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Difference between revisions of "HiSilicon"

Page Discussion
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| "7 nm"<br />TSMC N7 DUV
 
| "7 nm"<br />TSMC N7 DUV
 
| 2020/03<ref name="kirin 820 release">[http://www.hisilicon.com/en/Media-Center/News/Kirin820 Huawei Launches New-Gen 5G SoC Kirin 820]</ref>
 
| 2020/03<ref name="kirin 820 release">[http://www.hisilicon.com/en/Media-Center/News/Kirin820 Huawei Launches New-Gen 5G SoC Kirin 820]</ref>
 +
|-
 +
| [[HiSilicon Kirin 820E]]
 +
|
 +
* 3x ARM Cortex-A76 @ 2.22 GHz
 +
* 3x ARM Cortex-A55 @ 1.84 GHz
 +
| 6x ARM Mali-G57
 +
|
 +
| Kirin ISP 5.0
 +
| LPDDR4X Quad-channel 16-bit<br />@ 2133 MHz (34.1 GB/s)
 +
| 5G
 +
|
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| "7 nm"<br />TSMC N7 DUV
 +
| 2021/01
 
|-
 
|-
 
| [[HiSilicon Kirin 810]]
 
| [[HiSilicon Kirin 810]]

Revision as of 18:17, 22 January 2021

Premium

Model CPU[1] GPU[2] DSP[3] ISP[4] RAM Modem Catalog number Litography Release date
HiSilicon Kirin 9000
  • 1x ARM Cortex-A77 @ 3.13 GHz
  • 3x ARM Cortex-A77 @ 2.56 GHz
  • 4x ARM Cortex-A55 @ 2.05 GHz
 24x ARM Mali-G78 Kirin ISP 6.0
  • LPDDR5 Quad-channel 16-bit
    @ 2750 MHz (44 GB/s)
  • LPDDR4X Quad-channel 16-bit
    @ 2133 MHz (34.1 GB/s)
 5G "5 nm"
TSMC N5 EUV 		2020/10
HiSilicon Kirin 9000E
  • 1x ARM Cortex-A77 @ 3.13 GHz
  • 3x ARM Cortex-A77 @ 2.56 GHz
  • 4x ARM Cortex-A55 @ 2.05 GHz
 22x ARM Mali-G78 Kirin ISP 6.0
  • LPDDR5 Quad-channel 16-bit
    @ 2750 MHz (44 GB/s)
  • LPDDR4X Quad-channel 16-bit
    @ 2133 MHz (34.1 GB/s)
 5G "5 nm"
TSMC N5 EUV 		2020/10
HiSilicon Kirin 990 5G
  • 1x ARM Cortex-A76 @ 2.86 GHz
  • 3x ARM Cortex-A76 @ 2.36 GHz
  • 4x ARM Cortex-A55 @ 1.95 GHz
 16x ARM Mali-G76 @ 600 MHz
(737,28 GFLOPS) 		Kirin ISP 5.0 LPDDR4X Quad-channel 16-bit
@ 2133 MHz (34.1 GB/s) 		5G
(2300 / 1250 Mbps) 		"7 nm"
TSMC N7+ EUV 		2019/09[5]
HiSilicon Kirin 990 4G
  • 1x ARM Cortex-A76 @ 2.86 GHz
  • 3x ARM Cortex-A76 @ 2.09 GHz
  • 4x ARM Cortex-A55 @ 1.86 GHz
 16x ARM Mali-G76 @ 600 MHz
(737,28 GFLOPS) 		Kirin ISP 5.0 LPDDR4X Quad-channel 16-bit
@ 2133 MHz (34.1 GB/s) 		4G "7 nm"
TSMC N7 DUV 		2019/09[5]
HiSilicon Kirin 980
  • 2x ARM Cortex-A76 @ 2.6 GHz
  • 2x ARM Cortex-A76 @ 1.92 GHz
  • 4x ARM Cortex-A55 @ 1.8 GHz
 10x ARM Mali-G76 @ 720 MHz
(489.6 GFLOPS) 		Kirin ISP 4.0 LPDDR4X Quad-channel 16-bit
@ 2133 MHz (34.1 GB/s) 		4G
(1400 / 200 mbps) 		"7 nm"
TSMC N7 DUV 		2018/08[6]
HiSilicon Kirin 970
  • 4x ARM Cortex-A73 @ 2.36 GHz
  • 4x ARM Cortex-A53 @ 1.84 GHz
 12x ARM Mali-G72 @ 746 MHz
(330 GFLOPS) 		Cadence Tensilica Vision P6 LPDDR4X Quad-channel 16-bit
@ 1833 MHz (29.9 GB/s) 		4G
(1400 / 150 mbps) 		"10 nm"
TSMC 10 FinFET+ 		2017/09[7]
HiSilicon Kirin 960
  • 4x ARM Cortex-A73 @ 2.36 GHz
  • 4x ARM Cortex-A53 @ 1.84 GHz
 8x ARM Mali-G71 @ 1037 MHz
(282 GFLOPS) 		LPDDR4 Quad-channel 16-bit
@ 1600 MHz (28.8 GB/s) 		4G
(600 / 150 mbps) 		"16 nm"
TSMC 16FFC 		2016/10[8]
HiSilicon Kirin 955
  • 4x ARM Cortex-A72 @ 2.5 GHz
  • 4x ARM Cortex-A53 @ 1.8 GHz
 4x ARM Mali-T880 @ 900 MHz
(122.4 GFLOPS)
  • LPDDR4 Dual-channel 32-bit
    @ 1333 MHz (25.6 GB/s)
  • LPDDR3 Dual-channel 32-bit
    @ 933 MHz
 4G
(300 / 50 mbps) 		"16 nm"
TSMC 16FF+ 		2016/04[9]
HiSilicon Kirin 950
  • 4x ARM Cortex-A72 @ 2.3 GHz
  • 4x ARM Cortex-A53 @ 1.8 GHz
 4x ARM Mali-T880 @ 900 MHz
(122.4 GFLOPS)
  • LPDDR4 Dual-channel 32-bit
    @ 1333 MHz (25.6 GB/s)
  • LPDDR3 Dual-channel 32-bit
    @ 933 MHz
 4G
(300 / 50 mbps) 		"16 nm"
TSMC 16FF+ 		2015/11[10]
HiSilicon Kirin 935
  • 4x ARM Cortex-A53 @ 2.2 GHz
  • 4x ARM Cortex-A53 @ 1.5 GHz
 4x ARM Mali-T628 @ 680 MHz
(87 GFLOPS) 		(20 megapixels) LPDDR3 Dual-channel 32-bit
@ 800 MHz (12.8 GB/s) 		4G
(300 / 50 mbps) 		"28 nm"
TSMC 28HPC 		2015/04[11]
HiSilicon Kirin 930
  • 4x ARM Cortex-A53 @ 2.0 GHz
  • 4x ARM Cortex-A53 @ 1.5 GHz
 4x ARM Mali-T628 @ 600 MHz
(76.8 GFLOPS) 		(20 megapixels) LPDDR3 Dual-channel 32-bit
@ 800 MHz (12.8 GB/s) 		4G
(300 / 50 mbps) 		"28 nm"
TSMC 28HPC 		2015/04[11]
HiSilicon Kirin 928
  • 4x ARM Cortex-A15 @ 2.0 GHz
  • 4x ARM Cortex-A7 @ 1.3 GHz
 4x ARM Mali-T628 @ 600 MHz
(76.8 GFLOPS) 		LPDDR3 Dual-channel 32-bit
@ 800 MHz (12.8 GB/s) 		4G
(300 / 50 mbps) 		"28 nm"
TSMC 28HPM 		2014/10[12]
HiSilicon Kirin 925
  • 4x ARM Cortex-A15 @ 1.8 GHz
  • 4x ARM Cortex-A7 @ 1.3 GHz
 4x ARM Mali-T628 @ 600 MHz
(76.8 GFLOPS) 		LPDDR3 Dual-channel 32-bit
@ 800 MHz (12.8 GB/s) 		4G
(300 / 50 mbps) 		"28 nm"
TSMC 28HPM 		2014/09[13]
HiSilicon Kirin 920
  • 4x ARM Cortex-A15 @ 1.7 GHz
  • 4x ARM Cortex-A7 @ 1.3 GHz
 4x ARM Mali-T628 @ 600 MHz
(76.8 GFLOPS) 		Tensilica HIFI3 LPDDR3 Dual-channel 32-bit
@ 800 MHz (12.8 GB/s) 		4G
(300 / 50 mbps) 		"28 nm"
TSMC 28HPM 		2014/06[14]
HiSilicon Kirin 910T 4x ARM Cortex-A9 @ 1.8 GHz 4x ARM Mali-450 @ 700 MHz
(41.8 GFLOPS) 		(16 megapixals) LPDDR3 single-channel 32-bit
@ 800 MHz (6.4 GB/s) 		4G "28 nm"
TSMC 28HPM 		2014/05[15]
HiSilicon Kirin 910 4x ARM Cortex-A9 @ 1.6 GHz 4x ARM Mali-450 @ 533 MHz
(32 GFLOPS) 		(16 megapixals) LPDDR3 single-channel 32-bit
@ 800 MHz (6.4 GB/s) 		4G "28 nm"
TSMC 28HPM 		2014/05[15]
Model CPU GPU DSP ISP RAM Modem Catalog name Litography Release date

Intermediate

Model CPU[1] GPU[2] DSP[3] ISP[4] RAM Modem Catalog number Litography Release date
HiSilicon Kirin 985
  • 1x ARM Cortex-A76 @ 2.58 GHz
  • 3x ARM Cortex-A76 @ 2.40 GHz
  • 4x ARM Cortex-A55 @ 1.84 GHz
 8x ARM Mali-G77 Kirin ISP 5.0 LPDDR4X Quad-channel 16-bit
@ 2133 MHz (34.1 GB/s) 		5G "7 nm"
TSMC N7 DUV 		2020/04[16]
HiSilicon Kirin 820
  • 1x ARM Cortex-A76 @ 2.36 GHz
  • 3x ARM Cortex-A76 @ 2.22 GHz
  • 4x ARM Cortex-A55 @ 1.84 GHz
 6x ARM Mali-G57 Kirin ISP 5.0 LPDDR4X Quad-channel 16-bit
@ 2133 MHz (34.1 GB/s) 		5G "7 nm"
TSMC N7 DUV 		2020/03[17]
HiSilicon Kirin 820E
  • 3x ARM Cortex-A76 @ 2.22 GHz
  • 3x ARM Cortex-A55 @ 1.84 GHz
 6x ARM Mali-G57 Kirin ISP 5.0 LPDDR4X Quad-channel 16-bit
@ 2133 MHz (34.1 GB/s) 		5G "7 nm"
TSMC N7 DUV 		2021/01
HiSilicon Kirin 810
  • 2x ARM Cortex-A76 @ 2.27 GHz
  • 6x ARM Cortex-A55 @ 1.9 GHz
 6x ARM Mali-G52 @ 820 MHz LPDDR4X Quad-channel 16-bit
@ 2133 MHz (34.1 GB/s) 		4G "7 nm"
TSMC N7 DUV 		2019/06[18]
HiSilicon Kirin 710A
  • 4x ARM Cortex-A73 @ 2.0 GHz
  • 4x ARM Cortex-A53 @ 1.7 GHz
 4x ARM Mali-G51 @ 1000 MHz LPDDR4 32-bit 4G
(600 / 150 mbps) 		"14 nm"
SMIC 14 FinFET 		2020/05[19]
HiSilicon Kirin 710
  • 4x ARM Cortex-A73 @ 2.2 GHz
  • 4x ARM Cortex-A53 @ 1.7 GHz
 4x ARM Mali-G51 @ 1000 MHz LPDDR4 32-bit 4G
(600 / 150 mbps) 		"12 nm"
TSMC 12 FinFET 		2018/07[20]
Model CPU GPU DSP ISP RAM Modem Catalog name Litography Release date


Basic

Model CPU[1] GPU[2] DSP[3] ISP[4] RAM Modem Catalog number Litography Release date
HiSilicon Kirin 659
  • 4x ARM Cortex-A53 @ 2.36 GHz
  • 4x ARM Cortex-A53 @ 1.7 GHz
 2x ARM Mali-T830 (16 megapixels) LPDDR3 dual-channel 32-bit
@ 933 MHz 		4G
(300 mbps) 		"16 nm"
TSMC 16FF+ 		2017/07[21]
HiSilicon Kirin 658
  • 4x ARM Cortex-A53 @ 2.35 GHz
  • 4x ARM Cortex-A53 @ 1.7 GHz
 2x ARM Mali-T830 (16 megapixels) LPDDR3 dual-channel 32-bit
@ 933 MHz 		4G
(300 mbps) 		"16 nm"
TSMC 16FF+ 		2017/03[22]
HiSilicon Kirin 655
  • 4x ARM Cortex-A53 @ 2.12 GHz
  • 4x ARM Cortex-A53 @ 1.7 GHz
 2x ARM Mali-T830 (16 megapixels) LPDDR3 dual-channel 32-bit
@ 933 MHz 		4G
(300 mbps) 		"16 nm"
TSMC 16FF+ 		2016/10[23]
HiSilicon Kirin 650
  • 4x ARM Cortex-A53 @ 2.0 GHz
  • 4x ARM Cortex-A53 @ 1.7 GHz
 2x ARM Mali-T830 (16 megapixels) LPDDR3 dual-channel 32-bit
@ 933 MHz 		4G
(300 mbps) 		"16 nm"
TSMC 16FF+ 		2016/04[24]
HiSilicon Kirin 620
  • 4x ARM Cortex-A53 @ 1.2 GHz
 4x ARM Mali-450 (13 megapixels) LPDDR3 single-channel 32-bit
@ 600 MHz (6.4 GB/s) 		4G
(150 mbps) 		"28 nm"
TSMC 28HPM 		2015/04[25]
Model CPU GPU DSP ISP RAM Modem Catalog name Litography Release date

See also

References

  1. ↑ 1.0 1.1 1.2 Central Processing Unit.
  2. ↑ 2.0 2.1 2.2 Graphics Processing Unit, responsible for displaying graphics and text on the device screen.
  3. ↑ 3.0 3.1 3.2 Digital Signal Processor, responsible for measuring, filtering and compressing analog signals.
  4. ↑ 4.0 4.1 4.2 Image Signal Processor, responsible for processing the images captured by the camera.
  5. ↑ 5.0 5.1 Huawei Launches the latest flagship Kirin 990 and its enhanced 5G version
  6. ↑ Key Information About the Huawei Kirin 980
  7. ↑ Huawei Reveals the Future of Mobile AI at IFA 2017
  8. ↑ Huawei announces the HiSilicon Kirin 960: 4xA73 + 4xA53, G71MP8, CDMA
  9. ↑ New Huawei Flagship Device Combines Groundbreaking Innovations and Exceptional Design, Setting a New Standard in Smartphone Photography
  10. ↑ HUAWEI Announces the Octa-core Kirin 950 Processor
  11. ↑ 11.0 11.1 Huawei Announces New P8 And P8 Max
  12. ↑ Huawei Honor 6 Extreme Edition is official with Kirin 928 chip
  13. ↑ Huawei Ascend Mate 7 & Ascend G7 Hands-On
  14. ↑ Octa-core Huawei Kirin 920 chipset goes official
  15. ↑ 15.0 15.1 Huawei Launches Ascend P7 Based on Custom HiSilicon SoC
  16. ↑ Huawei Reasserts Itself as a Leader in 5G with the Latest 5G SoC Kirin 985
  17. ↑ Huawei Launches New-Gen 5G SoC Kirin 820
  18. ↑ Huawei Announces Nova 5 & Nova Pro in China: Introduces New Kirin 810 Chipset
  19. ↑ Huawei Kirin 710A chip achieves mass production
  20. ↑ Kirin 710 Key Messages
  21. ↑ Introducing the next generation HUAWEI nova 2 – perfect selfies from an elegant design
  22. ↑ Huawei P10 lite is finally official, hits the shelves on March 31
  23. ↑ Honor 6X with dual camera announced
  24. ↑ Huawei Honor 5C is official with a Kirin 650 SoC and 5.2" FullHD display
  25. ↑ Honor timeline
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