MediaTek Dimensity 700

MediaTek Dimensity 700
	MediaTek Dimensity 700 logo
General information
Marketed by	MediaTek
Announced	November 2020
Manufactured by	TSMC N7 ("7 nm");
Specifications
CPU(s)	8; 2x ARM Cortex-A76 @ 2.2 GHz; 6x ARM Cortex-A55 @ 2.0 GHz;
GPU	2x ARM Mali-G57 @ 950 MHz
NPU	MediaTek APU
RAM	LPDDR4x-4266
Storage	UFS 2.2
Modem	5G;
Architecture and classification
Application	Intermediate mobile
Process node	7 nm
Architecture	ARM
Microarchitecture	ARM Cortex-A76; ARM Cortex-A55
Instruction set	ARMv8 (64-bit)
Identification
Marketing name(s)	MediaTek Dimensity 700;
History
Predecessor	MediaTek Helio G90

MediaTek Dimensity 700 is an intermediate mobile processor from MediaTek, announced in November 2020.

Devices

MediaTek processors [e]
Premium	Dimensity 1000C 1000L 1000 1050 1100 1200 1300 8000 8100 8200 9000 9200 9300 (9300+) 9400
Premium	Helio X20 X23 X25 X27 X30
Intermediate	Dimensity 700 (6020) 720 800 800U 810 820 900 920 930 1080 7050 7200 7300
	Helio G70 G80 G85 G88 G90 G90T G95 G96 G99
	Helio P60 P65 P70 P90 P95 Helio X10
Basic	Helio G25 G35
	Helio P10 P15 P18 P20 P22 P23 P25 P30 P35
	A20 A22 A25
	MT6739
PC & tablets	Kompanio 500 (8183) 820 (8192) 1200 (8195) 1300T
	MT8127 MT8135 MT8163 MT8167 MT8168 MT8173 MT8175 MT8176
	MT8321 MT8735 MT8766 MT8768 MT8783 MT8785 MT8788
Set-top box & TV	MT5582 MT5596 MT5597 MT9602 MT9611 MT9612 MT9613 S900
Set-top box & TV	MT8693 MT8695 MT8696
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