MediaTek Dimensity 700
MediaTek Dimensity 700 logo | |
General information | |
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Marketed by | MediaTek |
Announced | November 2020[1] |
Manufactured by | |
Specifications | |
CPU(s) |
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GPU | 2x ARM Mali-G57 @ 950 MHz |
NPU | MediaTek APU |
RAM | LPDDR4x-4266 |
Storage | UFS 2.2 |
Modem | |
Architecture and classification | |
Application | Intermediate mobile |
Process node | 7 nm |
Architecture | ARM |
Microarchitecture | ARM Cortex-A76 ARM Cortex-A55 |
Instruction set | ARMv8 (64-bit) |
Identification | |
Marketing name(s) |
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History | |
Predecessor | MediaTek Helio G90 |
MediaTek Dimensity 700 is an intermediate mobile processor from MediaTek, announced in November 2020.
Devices
- Xiaomi Redmi Note 10 5G (2021/mar)
- TCL 30 5G (2022/feb)
Dimensity 6020
- iQOO Z7i (2023/mar)
MediaTek processors [e] | |
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Premium | |
Intermediate | |
Basic | |
PC & tablets | |
Set-top box & TV | |
Latest processors | |
[e]
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References