MediaTek Dimensity 810

MediaTek Dimensity 810 / 6080

MediaTek Dimensity 810 logo
General information
Marketed by	MediaTek
Announced	August 2021
Manufactured by	TSMC N6 ("6 nm")
Specifications
CPU(s)	8 4x ARM Cortex-A76 @ 2.4 GHz 4x ARM Cortex-A55 @ 2.0 GHz
GPU	2x ARM Mali-G57
NPU	MediaTek APU 3.0
ISP	MediaTek Imagiq 5.0
RAM	LPDDR4x-4266
Storage	UFS 2.2
Modem	5G
Architecture and classification
Application	Intermediate mobile
Process node	6 nm
Architecture	ARM
Microarchitecture	ARM Cortex-A76 ARM Cortex-A55
Instruction set	ARMv8 (64-bit)
Identification
Product code(s)	MT6833P MT6833GP MT6833V
Marketing name(s)	MediaTek Dimensity 810 MediaTek Dimensity 6080
History
Predecessor	MediaTek Dimensity 800
Successor	MediaTek Dimensity 6100+

MediaTek Dimensity 810 is an intermediate mobile processor from MediaTek, announced in August 2021.

Devices

• Realme 9 Pro (2022/Feb)

MediaTek processors [e]
Premium	Dimensity 9000 9200 9300 (9300+) 9400
	Dimensity 8000 8100 8200 8300 8400
	Dimensity 1000C 1000L 1000 1100 1200 1300
	Helio X20 X23 X25 X27 X30
Intermediate	Dimensity 7050 7200 (7350) 7300
	Dimensity 700 (6020) 720 800 800U 810 820 900 920 930 (7020/7025) 1050 (7030) 1080 (7050)
	Helio G70 G80 G85 G88 G90 G90T G95 G96 G99
	Helio P60 P65 P70 P90 P95 Helio X10
Basic	Dimensity 6020 6080 6100+ (6300)
	Helio G25 G35
	Helio P10 P15 P18 P20 P22 P23 P25 P30 P35
	A20 A22 A25
	MT6739
PC & tablets	Kompanio 500 (8183) 820 (8192) 1200 (8195) 1300T
	MT8127 MT8135 MT8163 MT8167 MT8168 MT8173 MT8175 MT8176
	MT8321 MT8735 MT8766 MT8768 MT8783 MT8785 MT8788
Set-top box & TV	MT5582 MT5596 MT5597 MT9602 MT9611 MT9612 MT9613 S900
	MT8693 MT8695 MT8696
Latest processors
MediaTek Dimensity 8400 (2024/Dec) Qualcomm Snapdragon 8 Elite (2024/Oct) MediaTek Dimensity 9400 (2024/Oct) Apple A18 Pro (2024/Sep) Apple A18 (2024/Sep) Qualcomm Snapdragon 8s Gen 3 (2024/Mar) Qualcomm Snapdragon X Elite gen 1 (2023/Oct) Qualcomm Snapdragon 8 Gen 3 (2023/Oct) Qualcomm Snapdragon 7 Gen 3 (2023/Oct) Qualcomm Snapdragon 7s Gen 2 (2023/Sep) Apple A17 (2023/Sep) HiSilicon Kirin 9000s (2023/Aug) Apple M2 Ultra (2023/Jun) MediaTek Dimensity 7050 (2023/May) Qualcomm Snapdragon 7+ Gen 2 (2023/Mar) Samsung Exynos 1380 (2023/Feb) Samsung Exynos 1330 (2023/Feb) MediaTek Dimensity 7200 (2023/Feb) Apple M2 Pro (2023/Jan) Apple M2 Max (2023/Jan) [e]

References

• MediaTek Dimensity 810