MediaTek Dimensity 700
MediaTek Dimensity 700 is an intermediate mobile processor from MediaTek, announced in November 2020.
 MediaTek Dimensity 700 logo | |
| General information | |
|---|---|
| Marketed by | MediaTek |
| Announced | November 2020[1] |
| Manufactured by | |
| Specifications | |
| CPU(s) |
|
| GPU | 2x ARM Mali-G57 @ 950 MHz |
| NPU | MediaTek APU |
| RAM | LPDDR4x-4266 |
| Storage | UFS 2.2 |
| Modem | |
| Architecture and classification | |
| Application | Intermediate mobile |
| Process node | 7 nm |
| Architecture | ARM |
| Microarchitecture | ARM Cortex-A76 ARM Cortex-A55 |
| Instruction set | ARMv8 (64-bit) |
| Identification | |
| Marketing name(s) |
|
| History | |
| Predecessor | MediaTek Helio G90 |
Devices
- Xiaomi Redmi Note 10 5G (2021/mar)
- TCL 30 5G (2022/feb)
Dimensity 6020
- iQOO Z7i (2023/mar)
| MediaTek processors [e] | |
|---|---|
| Premium | |
| Intermediate | |
| Basic | |
| PC & tablets | |
| Set-top box & TV | |
| Latest processors | |
[e]
| |