Difference between revisions of "MediaTek Dimensity 700"
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| − | | produced-start = [[:category:2020 processors|November 2020]]<ref name="dimensity | + | | produced-start = [[:category:2020 processors|November 2020]]<ref name="dimensity 700 release">[https://www.mediatek.com/news-events/press-releases/mediatek-unveils-its-newest-5g-chipset-dimensity-700-for-mass-market-5g-smartphones MediaTek Unveils Its Newest 5G Chipset, Dimensity 700, For Mass Market 5G Smartphones]</ref> |
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| manuf1 = [[:category:7 nm processors|TSMC N7 ("7 nm")]] | | manuf1 = [[:category:7 nm processors|TSMC N7 ("7 nm")]] | ||
Revision as of 16:58, 10 November 2020
 MediaTek Dimensity 700 logo | |
| General information | |
|---|---|
| Marketed by | MediaTek |
| Announced | November 2020[1] |
| Manufactured by | |
| Specifications | |
| CPU(s) |
|
| GPU | 2x ARM Mali-G57 @ 950 MHz |
| NPU | MediaTek APU |
| RAM | LPDDR4x-4266 |
| Storage | UFS 2.2 |
| Modem | |
| Architecture and classification | |
| Application | Intermediate mobile |
| Process node | 7 nm |
| Architecture | ARM |
| Microarchitecture | ARM Cortex-A76 ARM Cortex-A55 |
| Instruction set | ARMv8 (64-bit) |
| Identification | |
| Marketing name(s) |
|
| History | |
| Predecessor | MediaTek Helio G90 |
MediaTek Dimensity 700 is an intermediate mobile processor from MediaTek, announced in November 2020.
Devices
References