Qualcomm Snapdragon 870
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 Snapdragon 870 logo | |
| General information | |
|---|---|
| Marketed by | Qualcomm |
| Announced | January 2021[1] |
| Manufactured by | |
| Specifications | |
| CPU(s) |
|
| GPU | Adreno 650 |
| NPU | Hexagon 698 |
| ISP | Spectra 480 |
| DSP | Hexagon 698 |
| RAM | LPDDR5-5500, LPDDR4X-4266 |
| Storage | UFS 3.1 |
| Modem | |
| Architecture and classification | |
| Application | Premium mobile |
| Process node | 7 nm |
| Architecture | ARM |
| Microarchitecture | ARM Cortex-A77 ARM Cortex-A55 |
| Instruction set | ARMv8 (64-bit) |
| Cache | |
| Cache L1 | 128 KiB + 384 KiB + 512 KiB |
| Cache L2 | 512 KiB + 768 KiB + 512 KiB |
| Cache L3 | 4 MiB |
| Identification | |
| Product code(s) |
|
| Model(s) |
|
| Marketing name(s) |
|
| Variant(s) | Snapdragon 865 Snapdragon 865+ |
| Core name(s) |
|
| History | |
| Predecessor | Qualcomm Snapdragon 865+ |
| Successor | Qualcomm Snapdragon 888 |
Qualcomm Snapdragon 870 is a premium mobile processor from Qualcomm, announced in January 2021.
The processor doesn't include an integrated modem, being sold together with the Qualcomm X55 5G modem.