Qualcomm Snapdragon 870
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![]() Snapdragon 870 logo | |
General information | |
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Marketed by | Qualcomm |
Announced | January 2021[1] |
Manufactured by | |
Specifications | |
CPU(s) |
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GPU | Adreno 650 |
NPU | Hexagon 698 |
ISP | Spectra 480 |
DSP | Hexagon 698 |
RAM | LPDDR5-5500, LPDDR4X-4266 |
Storage | UFS 3.1 |
Modem | |
Architecture and classification | |
Application | Premium mobile |
Process node | 7 nm |
Architecture | ARM |
Microarchitecture | ARM Cortex-A77 ARM Cortex-A55 |
Instruction set | ARMv8 (64-bit) |
Cache | |
Cache L1 | 128 KiB + 384 KiB + 512 KiB |
Cache L2 | 512 KiB + 768 KiB + 512 KiB |
Cache L3 | 4 MiB |
Identification | |
Product code(s) |
|
Model(s) |
|
Marketing name(s) |
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Variant(s) | Snapdragon 865 Snapdragon 865+ |
Core name(s) |
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History | |
Predecessor | Qualcomm Snapdragon 865+ |
Successor | Qualcomm Snapdragon 888 |
Qualcomm Snapdragon 870 is a premium mobile processor from Qualcomm, announced in January 2021.
The processor doesn't include an integrated modem, being sold together with the Qualcomm X55 5G modem.