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HiSilicon Kirin 810

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HiSilicon Kirin 810
HiSilicon Kirin 810
HiSilicon Kirin 810
General information
Marketed byHuawei/HiSilicon
AnnouncedJune 2019[1]
Manufactured by
Specifications
CPU(s)
  • 8
  • 2x ARM Cortex-A76 @ 2.27 GHz
  • 6x ARM Cortex-A55 @ 1.9 GHz
GPU6x ARM Mali-G52
NPUHuawei Da Vinci
ISPHiSilicon Kirin ISP 5.0
RAMLPDDR4X-4266
Modem
Architecture and classification
ApplicationIntermediate mobile
Process node7 nm
ArchitectureARM
Instruction setARMv8.2-A (64-bit)
Identification
Marketing name(s)
  • Kirin 810
Core name(s)
  • ARM Cortex-A76
  • ARM Cortex-A55
History
PredecessorHiSilicon Kirin 710
SuccessorHiSilicon Kirin 825

HiSilicon Kirin 810 is an intermediate mobile processor from Huawei/HiSilicon, announced in June, 2019.

Devices

References