Unisoc Tanggula T760

Unisoc Tanggula T760
	Unisoc Tanggula T760 logo
General information
Marketed by	Unisoc
Announced	April 2021
Manufactured by	TSMC N6 ("6 nm");
Specifications
CPU(s)	8; 4x ARM Cortex-A76 @ 2.2 GHz; 4x ARM Cortex-A55;
GPU	ARM Mali-G57
ISP	Unisoc Vivamagic 6.0
DSP	VQ7
RAM	LPDDR4X-4266
Storage	UFS 3.1; eMMC 5.1
Modem	5G Unisoc V510;
Architecture and classification
Application	Intermediate mobile
Process node	6 nm
Architecture	ARM
Microarchitecture	ARM Cortex-A76; ARM Cortex-A55
Instruction set	ARMv8.2-A (64-bit)
Identification
Variant(s)	Unisoc Tanggula T760
History
Predecessor	Unisoc Tiger T7520

Unisoc Tanggula T760 is an intermediate mobile processor from Unisoc, announced in April 2021.

Devices

Unisoc processors [e]
Intermediate	Tiger T606 Tiger T610 Tiger T616 Tiger T618 Tiger T700 Tiger T710 Tiger T7520 Tanggula T740 Tanggula T760 Tanggula T770
Basic	SC7731E SC9832E SC9863A Tiger T310
Latest processors
MediaTek Dimensity 9400 (2024/Oct) Apple A18 Pro (2024/Sep) Apple A18 (2024/Sep) Qualcomm Snapdragon 8s Gen 3 (2024/Mar) Qualcomm Snapdragon X Elite gen 1 (2023/Oct) Qualcomm Snapdragon 8 Gen 3 (2023/Oct) Qualcomm Snapdragon 7 Gen 3 (2023/Oct) Qualcomm Snapdragon 7s Gen 2 (2023/Sep) Apple A17 (2023/Sep) HiSilicon Kirin 9000s (2023/Aug) Apple M2 Ultra (2023/Jun) MediaTek Dimensity 7050 (2023/May) Qualcomm Snapdragon 7+ Gen 2 (2023/Mar) Samsung Exynos 1380 (2023/Feb) Samsung Exynos 1330 (2023/Feb) MediaTek Dimensity 7200 (2023/Feb) Apple M2 Pro (2023/Jan) Apple M2 Max (2023/Jan) MediaTek Dimensity 8200 (2022/Dec) Qualcomm Snapdragon 782G (2022/Nov) [e]