Qualcomm Snapdragon 425

Snapdragon 425
	Snapdragon 425 logo
General information
Marketed by	Qualcomm
Announced	February 2016
Manufactured by	28LP ("28 nm");
Specifications
CPU(s)	4; 4x ARM Cortex-A53 @ 1.4 GHz;
GPU	Adreno 308
DSP	Hexagon 536
RAM	LPDDR3-1333
Storage	eMMC 5.1; SD 3.0
Modem	4G;
Architecture and classification
Application	Basic mobile
Process node	28 nm
Architecture	ARM
Microarchitecture	ARM Cortex-A53
Instruction set	ARMv8 (64-bit)
Identification
Product code(s)	MSM8917;
Model(s)	SDM425;
Marketing name(s)	Snapdragon 425 Mobile Platform;
Variant(s)	Qualcomm Snapdragon 435
History
Predecessor	Qualcomm Snapdragon 412
Successor	Qualcomm Snapdragon 427

Qualcomm Snapdragon 425 is a basic mobile processor from Qualcomm, announced in February 2016.

Devices

Qualcomm processors [e]
Premium	Snapdragon 800 801 805 808 810 820 821 835 845 855 (855+, 860) 865 (865+, 870) 888 (888+) 8 Gen 1 (8+g1) 8 Gen 2 8 Gen 3 (8sg3)
Premium	Snapdragon S1 S2 S3 S4 Plus S4 Pro
Intermediate	Snapdragon 710 712 720G 730G 732G 750G 765 (765G, 768G) 778G (778G+, 782G) 780G 7 Gen 1 7s Gen 2 7+ Gen 2 7 Gen 3
Intermediate	Snapdragon 600 610 615 616 617 625 626 630 632 636 650 652 653 660 662 665 670 675 678 680 690 695 6 Gen 1
Basic	Snapdragon 400 410 412 415 425 427 429 430 435 439 450 460 480 (480+) 4 Gen 1
PC	Snapdragon 835 850 7c 8c 8cx 8cx Gen 3
Latest processors
Qualcomm Snapdragon 8s Gen 3 (2024/Mar) Qualcomm Snapdragon X Elite gen 1 (2023/Oct) Qualcomm Snapdragon 8 Gen 3 (2023/Oct) Qualcomm Snapdragon 7 Gen 3 (2023/Oct) Qualcomm Snapdragon 7s Gen 2 (2023/Sep) Apple A17 (2023/Sep) HiSilicon Kirin 9000s (2023/Aug) Apple M2 Ultra (2023/Jun) MediaTek Dimensity 7050 (2023/May) Qualcomm Snapdragon 7+ Gen 2 (2023/Mar) Samsung Exynos 1380 (2023/Feb) Samsung Exynos 1330 (2023/Feb) MediaTek Dimensity 7200 (2023/Feb) Apple M2 Pro (2023/Jan) Apple M2 Max (2023/Jan) MediaTek Dimensity 8200 (2022/Dec) Qualcomm Snapdragon 782G (2022/Nov) MediaTek Dimensity 9200 (2022/Nov) Google Tensor G2 (2022/Oct) MediaTek Dimensity 1080 (2022/Oct) [e]