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Premium

Model CPU[1] GPU[2] DSP[3] ISP[4] RAM Modem Catalog number Lithography Release date
Dimensity 1000
  • 4x ARM Cortex-A77 @ 2.6 GHz
  • 4x ARM Cortex-A55 @ 2.0 GHz
 9x ARM Mali-G77 (4.5 TOPS)
MediaTek APU 3.0 		(80 megapixels) LPDDR4x quad-channel 16-bit
@ 1866 MHz (29.9 GB/s) 		5G
(4700 / 2300 mbps) 		MT6889[5] "7 nm"
TSMC N7 		2019/11[6]
Dimensity 1000L
  • 4x ARM Cortex-A77 @ 2.2 GHz
  • 4x ARM Cortex-A55 @ 2.0 GHz
 7x ARM Mali-G77 @ 695 MHz MediaTek APU 3.0 LPDDR4x quad-channel 16-bit
@ 1866 MHz (29.9 GB/s) 		5G
(4700 / 2300 mbps) 		MT6885Z "7 nm"
TSMC N7 		2019/11[6]
Dimensity 1000C
  • 4x ARM Cortex-A77 @ 2.0 GHz
  • 4x ARM Cortex-A55 @ 2.0 GHz
 5x ARM Mali-G57 MediaTek APU 3.0 (64 megapixels) LPDDR4x quad-channel 16-bit
@ 1866 MHz (29.9 GB/s) 		5G
(2300 / 1200 mbps) 		"7 nm"
TSMC N7 		2020/09[7]
Helio X30
  • 2x ARM Cortex-A73 @ 2.5 GHz
  • 4x ARM Cortex-A53 @ 2.2 GHz
  • 4x ARM Cortex-A35 @ 1.9 GHz
 4x PowerVR 7XTP @ 850 MHz Cadence Tensilica P5 DSP (28 megapixels)
MediaTek Imagiq 2.0 		LPDDR4x quad-channel 16-bit
@ 1866 MHz (29.9 GB/s) 		4G
(450 / 150 mbps) 		MT6799 "10 nm"
TSMC 10FF 		2017/02[8]
Helio X27
  • 2x ARM Cortex-A72 @ 2.6 GHz
  • 4x ARM Cortex-A53 @ 2.0 GHz
  • 4x ARM Cortex-A53 @ 1.6 GHz
 4x ARM Mali-T880 @ 875 MHz (32 megapixels)
MediaTek Imagiq 		LPDDR3 dual-channel 32-bit
@ 800 MHz 		4G
(300 / 50 mbps) 		MT6797x[9] "20 nm"
TSMC 20 		2016/12[10]
Helio X25
  • 2x ARM Cortex-A72 @ 2.5 GHz
  • 4x ARM Cortex-A53 @ 2.0 GHz
  • 4x ARM Cortex-A53 @ 1.55 GHz
 4x ARM Mali-T880 @ 850 MHz (32 megapixels)
MediaTek Imagiq 		LPDDR3 dual-channel 32-bit
@ 800 MHz 		4G
(300 / 50 mbps) 		MT6797T[11] "20 nm"
TSMC 20 		2016/03[12]
Helio X23
  • 2x ARM Cortex-A72 @ 2.3 GHz
  • 4x ARM Cortex-A53 @ 1.85 GHz
  • 4x ARM Cortex-A53 @ 1.4 GHz
 4x ARM Mali-T880 @ 800 MHz (32 megapixels)
MediaTek Imagiq 		LPDDR3 dual-channel 32-bit
@ 800 MHz 		4G
(300 / 50 mbps) 		MT6797D[13] "20 nm"
TSMC 20 		2016/12[10]
Helio X20
  • 2x ARM Cortex-A72 @ 2.1 GHz
  • 4x ARM Cortex-A53 @ 1.85 GHz
  • 4x ARM Cortex-A53 @ 1.4 GHz
 4x ARM Mali-T880 @ 780 MHz (32 megapixels)
MediaTek Imagiq 		LPDDR3 dual-channel 32-bit
@ 800 MHz 		4G
(300 / 50 mbps) 		MT6797[14] "20 nm"
TSMC 20 		2015/05[15]
Model CPU GPU DSP ISP RAM Modem Catalog name Lithography Release date

Intermediate

Model CPU[1] GPU[2] DSP[3] ISP[4] RAM Modem Catalog number Lithography Release date
Dimensity 700
  • 2x ARM Cortex-A76 @ 2.2 GHz
  • 6x ARM Cortex-A55 @ 2.0 GHz
 2x ARM Mali-G57 @ 950 MHz (64 megapixels) LPDDR4x dual-channel 16-bit
@ 2133 MHz (17.1 GB/s) 		5G
(2770 mbps) 		"7 nm"
TSMC N7 		2020/11[16]
Dimensity 820
  • 4x ARM Cortex-A76 @ 2.6 GHz
  • 4x ARM Cortex-A55 @ 2.0 GHz
 5x ARM Mali-G57 @ 900 MHz 2.4 TOPS
MediaTek APU 3.0 		(80 megapixels)
MediaTek Imagiq 5.0 		LPDDR4x dual-channel 16-bit
@ 2133 MHz (17.1 GB/s) 		5G
(2300 / 1200 mbps) 		MT6875 "7 nm"
TSMC N7 		2020/05[17]
Dimensity 800U
  • 4x ARM Cortex-A76 @ 2.4 GHz
  • 4x ARM Cortex-A55 @ 2.0 GHz
 3x ARM Mali-G57 2.4 TOPS
MediaTek APU 3.0 		(64 megapixels) LPDDR4x dual-channel 16-bit
@ 2133 MHz (17.1 GB/s) 		5G
(2300 / 1200 mbps) 		"7 nm"
TSMC N7 		2020/08[18]
Dimensity 800
  • 4x ARM Cortex-A76 @ 2.0 GHz
  • 4x ARM Cortex-A55 @ 2.0 GHz
 4x ARM Mali-G57 (64 megapixels) LPDDR4x dual-channel 16-bit
@ 2133 MHz (17.1 GB/s) 		5G
(2300 / 1200 mbps) 		MT6873 "7 nm"
TSMC N7 		2020/01[19]
Dimensity 720
  • 2x ARM Cortex-A76 @ 2.0 GHz
  • 6x ARM Cortex-A55 @ 2.0 GHz
 3x ARM Mali-G57 (64 megapixels) LPDDR4x dual-channel 16-bit
@ 2133 MHz (17.1 GB/s) 		5G
(2770 mbps) 		MT6853 "7 nm"
TSMC N7 		2020/07[16]
Helio X10 8x ARM Cortex-A53 @ 2.0 GHz PowerVR G6200 @ 700 MHz (20 megapixels) LPDDR3 dual-channel 32-bit
@ 933 MHz (14.9 GB/s) 		4G
(150 / 50 mbps) 		MT6795[20] "28 nm"
TSMC 28HPm 		2014/07[21]
Model CPU GPU DSP ISP RAM Modem Catalog name Lithography Release date

References

  1. ↑ Jump up to: 1.0 1.1 Central Processing Unit.
  2. ↑ Jump up to: 2.0 2.1 Graphics Processing Unit, responsible for displaying graphics and text on the device screen.
  3. ↑ Jump up to: 3.0 3.1 Digital Signal Processor, responsible for measuring, filtering and compressing analog signals.
  4. ↑ Jump up to: 4.0 4.1 Image Signal Processor, responsible for processing the images captured by the camera.
  5. ↑ MediaTek Dimensity 1000 tops Antutu performance
  6. ↑ Jump up to: 6.0 6.1 MediaTek Announces Dimensity, World’s Most Advanced 5G Chipset Family, & Dimensity 1000 5G SoC
  7. ↑ Dimensity 5G Chipset Unveiled For First MediaTek Powered 5G Smartphone in the United States
  8. ↑ MediaTek Unveils Helio X30 to Power Premium Mobile Experiences
  9. ↑ MediaTek Helio X27
  10. ↑ Jump up to: 10.0 10.1 MediaTek Helio X23 & X27 Set New Benchmark in User Experience
  11. ↑ MediaTek Helio X25
  12. ↑ MediaTek's 10-core mobile chip hits the market next month
  13. ↑ MediaTek Helio X23
  14. ↑ MediaTek Helio X20
  15. ↑ MediaTek Launches the MediaTek Helio™ X20: The World’s First Mobile SoC Featuring Tri-Cluster™ CPU Architecture
  16. ↑ Jump up to: 16.0 16.1 MediaTek Unveils Its Newest 5G Chipset, Dimensity 700, For Mass Market 5G Smartphones Cite error: Invalid <ref> tag; name "dimensity 720 release" defined multiple times with different content
  17. ↑ MediaTek’s New Dimensity 820 Chip Brings Incredible 5G Experiences to Smartphones
  18. ↑ MediaTek Introduces Newest 5G SoC, Dimensity 800U for Ultra Connectivity and Advanced 5G Dual SIM Technology
  19. ↑ MediaTek Announces Dimensity 800 5G Series Chipsets for New Premium 5G Smartphones
  20. ↑ MediaTek Helio X10
  21. ↑ MediaTek Launches 64-bit True Octa-core™ LTE Smartphone SoC with World’s First 2K Display Support
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