Difference between revisions of "Unisoc"

Latest revision as of 16:42, 21 October 2021

Intermediate

Model	CPU^[1]	GPU^[2]	DSP^[3]	ISP^[4]	RAM	Modem	Catalog number	Lithography	Release date
Tanggula T770	4x ARM Cortex-A76 @ 2.5 GHz 4x ARM Cortex-A55	ARM Mali-G57	(4.8 TOPS) VQ7	(108 megapixels) Unisoc Vivamagic 6	LPDDR4x @ 2133 MHz	5G		"6 nm" TSMC N6	2021/04^[5]
Tanggula T760	4x ARM Cortex-A76 @ 2.2 GHz 4x ARM Cortex-A55	ARM Mali-G57	(2.4 TOPS) VQ7	(64 megapixels) Unisoc Vivamagic 6	LPDDR4x @ 2133 MHz	5G		"6 nm" TSMC N6	2021/04^[5]
Tanggula T740	4x ARM Cortex-A75 @ 2.0 GHz 4x ARM Cortex-A55 @ 1.8 GHz	PowerVR 9446	(3.2 TOPS) XM6	(64 megapixels) Unisoc Vivamagic 6	LPDDR4x @ 1866 MHz	5G		"6 nm" TSMC N6	2021/04^[5]
Tiger T7520	4x ARM Cortex-A76 @ 2.7 GHz 4x ARM Cortex-A55 @ 2.0 GHz	ARM Mali-G57	(8 TOPS)	(100 megapixels) Unisoc Vivamagic 6	LPDDR4x @ 2133 MHz	5G (3250 mbps)	T7520	"6 nm" TSMC N6	2020/02^[6]
Tiger T710	4x ARM Cortex-A75 @ 2.0 GHz 4x ARM Cortex-A55 @ 1.8 GHz	PowerVR 9444 @ 800 MHz	(3.2 TOPS)	(100 megapixels) Unisoc Vivamagic 6.0	LPDDR4x @ 1866 MHz	4G	T710 T7510 (w/ Ivy V510 5G modem)	"12 nm" TSMC 12FF	2020/02^[7]
Tiger T700	2x ARM Cortex-A75 @ 1.8 GHz 6x ARM Cortex-A55 @ 1.8 GHz	2x ARM Mali-G52			LPDDR4 @ 1866 MHz	4G	T700	"12 nm" TSMC 12FF	2021
Tiger T618	2x ARM Cortex-A75 @ 2.0 GHz 6x ARM Cortex-A55 @ 2.0 GHz	2x ARM Mali-G52		(32 megapixels)	LPDDR4 @ 1866 MHz	4G	T618	"12 nm" TSMC 12FF
Tiger T616	2x ARM Cortex-A75 @ 2.0 GHz 6x ARM Cortex-A55 @ 1.8 GHz	2x ARM Mali-G57		(64 megapixels)	LPDDR4 @ 1600 MHz	4G	T616	"12 nm" TSMC 12FF	2021/09^[8]
Tiger T610	2x ARM Cortex-A75 @ 1.8 GHz 6x ARM Cortex-A55 @ 1.8 GHz	2x ARM Mali-G52		(64 megapixels)	LPDDR4 @ 1600 MHz	4G	T610	"12 nm" TSMC 12FF
Tiger T606	2x ARM Cortex-A75 @ 1.6 GHz 6x ARM Cortex-A55 @ 1.6 GHz	2x ARM Mali-G57		(64 megapixels)	LPDDR4 @ 1600 MHz	4G	T606	"12 nm" TSMC 12FF	2021/09^[8]
Model	CPU	GPU	DSP	ISP	RAM	Modem	Catalog name	Lithography	Release date

Basic

Model	CPU^[1]	GPU^[2]	DSP^[3]	ISP^[4]	RAM	Modem	Catalog number	Lithography	Release date
Tiger T310	1x ARM Cortex-A75 @ 2.0 GHz 3x ARM Cortex-A55 @ 1.8 GHz	PowerVR GT7200			LPDDR4 @ 2133 MHz	4G	T310	"12 nm" TSMC 12FF
SC9863A	8x ARM Cortex-A55 @ 1.6 GHz	PowerVR GE8322			LPDDR4	4G		"28 nm" TSMC 28HPC+
SC9832E	4x ARM Cortex-A7 @ 1.4 GHz	ARM Mali-T820			LPDDR3	4G		"28 nm" TSMC 28HPm
SC7731E	4x ARM Cortex-A7 @ 1.3 GHz	ARM Mali-T820			LPDDR3	3G		"28 nm" TSMC 28HPm
Model	CPU	GPU	DSP	ISP	RAM	Modem	Catalog name	Lithography	Release date

References

↑ ^1.0 ^1.1 Central Processing Unit.
↑ ^2.0 ^2.1 Graphics Processing Unit, responsible for displaying graphics and text on the device screen.
↑ ^3.0 ^3.1 Digital Signal Processor, responsible for measuring, filtering and compressing analog signals.
↑ ^4.0 ^4.1 Image Signal Processor, responsible for processing the images captured by the camera.
↑ ^5.0 ^5.1 ^5.2 Ziguang Zhanrui: Make a big break and become the ecological bearer of the digital world
↑ UNISOC Launches New-Gen 5G SoC T7520
↑ UNISOC T7510 Powers Hisense's 5G Smartphone, the Hisense Phone F50
↑ ^8.0 ^8.1 Unisoc T616 and T606 announcement

Unisoc processors [e]
Intermediate	Tiger T606 Tiger T610 Tiger T616 Tiger T618 Tiger T700 Tiger T710 Tiger T7520 Tanggula T740 Tanggula T760 Tanggula T770
Basic	SC7731E SC9832E SC9863A Tiger T310
Latest processors
MediaTek Dimensity 8400 (2024/Dec) Qualcomm Snapdragon 8 Elite (2024/Oct) MediaTek Dimensity 9400 (2024/Oct) Apple A18 Pro (2024/Sep) Apple A18 (2024/Sep) Qualcomm Snapdragon 8s Gen 3 (2024/Mar) Qualcomm Snapdragon X Elite gen 1 (2023/Oct) Qualcomm Snapdragon 8 Gen 3 (2023/Oct) Qualcomm Snapdragon 7 Gen 3 (2023/Oct) Qualcomm Snapdragon 7s Gen 2 (2023/Sep) Apple A17 (2023/Sep) HiSilicon Kirin 9000s (2023/Aug) Apple M2 Ultra (2023/Jun) MediaTek Dimensity 7050 (2023/May) Qualcomm Snapdragon 7+ Gen 2 (2023/Mar) Samsung Exynos 1380 (2023/Feb) Samsung Exynos 1330 (2023/Feb) MediaTek Dimensity 7200 (2023/Feb) Apple M2 Pro (2023/Jan) Apple M2 Max (2023/Jan) [e]

[cpu-1] 1.0 ^1.1 Central Processing Unit.

[gpu-2] 2.0 ^2.1 Graphics Processing Unit, responsible for displaying graphics and text on the device screen.

[dsp-3] 3.0 ^3.1 Digital Signal Processor, responsible for measuring, filtering and compressing analog signals.

[isp-4] 4.0 ^4.1 Image Signal Processor, responsible for processing the images captured by the camera.

[tanggula_t770_t760_t740_release-5] 5.0 ^5.1 ^5.2 Ziguang Zhanrui: Make a big break and become the ecological bearer of the digital world

[tiger_t7520_release-6] UNISOC Launches New-Gen 5G SoC T7520

[tiger_t7510_release-7] UNISOC T7510 Powers Hisense's 5G Smartphone, the Hisense Phone F50

[t616_t606_release-8] 8.0 ^8.1 Unisoc T616 and T606 announcement

[1]

[2]

[3]

[4]

[5]

[6]

[7]

[8]

@@ Line 78: / Line 78: @@
 | "12 nm"<br />TSMC 12FF
 | 2020/02<ref name="tiger t7510 release">[https://www.unisoc.com/unisoc-t7510-powers-hisenses-5g-smartphone-hisense-phone-f50 UNISOC T7510 Powers Hisense's 5G Smartphone, the Hisense Phone F50]</ref>
+|-
+| [[Unisoc Tiger T700|Tiger T700]]
+|
+* 2x ARM Cortex-A75 @ 1.8 GHz
+* 6x ARM Cortex-A55 @ 1.8 GHz
+| 2x ARM Mali-G52
+|
+|
+| LPDDR4<br />@ 1866 MHz
+| 4G<br />
+| T700
+| "12 nm"<br />TSMC 12FF
+| 2021
 |-
 | [[Unisoc Tiger T618|Tiger T618]]
@@ Line 91: / Line 104: @@
 | "12 nm"<br />TSMC 12FF
 |
+|-
+| [[Unisoc T616|Tiger T616]]
+|
+* 2x ARM Cortex-A75 @ 2.0 GHz
+* 6x ARM Cortex-A55 @ 1.8 GHz
+| 2x ARM Mali-G57
+|
+| (64 megapixels)
+| LPDDR4<br />@ 1600 MHz
+| 4G<br />
+| T616
+| "12 nm"<br />TSMC 12FF
+| 2021/09<ref name="t616 t606 release">[https://twitter.com/UNISOCTech/status/1435475496389709826 Unisoc T616 and T606 announcement]</ref>
 |-
 | [[Unisoc Tiger T610|Tiger T610]]
@@ Line 104: / Line 130: @@
 | "12 nm"<br />TSMC 12FF
 |
+|-
+| [[Unisoc T606|Tiger T606]]
+|
+* 2x ARM Cortex-A75 @ 1.6 GHz
+* 6x ARM Cortex-A55 @ 1.6 GHz
+| 2x ARM Mali-G57
+|
+| (64 megapixels)
+| LPDDR4<br />@ 1600 MHz
+| 4G<br />
+| T606
+| "12 nm"<br />TSMC 12FF
+| 2021/09<ref name="t616 t606 release" />
 |-
 ! Model