HiSilicon Kirin 985

HiSilicon Kirin 985
	HiSilicon Kirin 985
General information
Marketed by	Huawei/HiSilicon
Announced	April 2020
Manufactured by	TSMC N7 ("7 nm");
Specifications
CPU(s)	8; 1x ARM Cortex-A76 @ 2.58 GHz; 3x ARM Cortex-A76 @ 2.40 GHz; 4x ARM Cortex-A55 @ 1.84 GHz;
GPU	8x ARM Mali-G77
NPU	Huawei Da Vinci
ISP	HiSilicon Kirin ISP 5.0
RAM	LPDDR4X-4266
Modem	4G;
Architecture and classification
Application	Intermediate mobile
Process node	7 nm
Architecture	ARM
Instruction set	ARMv8.2-A (64-bit)
Identification
Marketing name(s)	Kirin 985;
Core name(s)	ARM Cortex-A76; ARM Cortex-A55;
History
Predecessor	HiSilicon Kirin 820
Successor	HiSilicon Kirin 9000E

HiSilicon Kirin 985 is an intermediate mobile processor from Huawei/HiSilicon, announced in April, 2020.

Devices

HiSilicon processors [e]
Premium	Kirin 910 910T 920 925 928 930 935 950 955 960 970 980 990 9000E 9000 9000s
Intermediate	Kirin 710 810 820E 820 985
Basic	Kirin 620 650 655 658 659
Latest processors
Qualcomm Snapdragon 8s Gen 3 (2024/Mar) Qualcomm Snapdragon X Elite gen 1 (2023/Oct) Qualcomm Snapdragon 8 Gen 3 (2023/Oct) Qualcomm Snapdragon 7 Gen 3 (2023/Oct) Qualcomm Snapdragon 7s Gen 2 (2023/Sep) Apple A17 (2023/Sep) HiSilicon Kirin 9000s (2023/Aug) Apple M2 Ultra (2023/Jun) MediaTek Dimensity 7050 (2023/May) Qualcomm Snapdragon 7+ Gen 2 (2023/Mar) Samsung Exynos 1380 (2023/Feb) Samsung Exynos 1330 (2023/Feb) MediaTek Dimensity 7200 (2023/Feb) Apple M2 Pro (2023/Jan) Apple M2 Max (2023/Jan) MediaTek Dimensity 8200 (2022/Dec) Qualcomm Snapdragon 782G (2022/Nov) MediaTek Dimensity 9200 (2022/Nov) Google Tensor G2 (2022/Oct) MediaTek Dimensity 1080 (2022/Oct) [e]