Difference between revisions of "MediaTek"
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! Lithography | ! Lithography | ||
! Release date | ! Release date | ||
+ | |- | ||
+ | | [[MediaTek Dimensity 9400|Dimensity 9400]] | ||
+ | | | ||
+ | * 1x ARM Cortex-X925 @ 3.62 GHz | ||
+ | * 3x ARM Cortex-X4 @ 2.85 GHz | ||
+ | * 4x ARM Cortex-A720 @ ? GHz | ||
+ | | 12x ARM Immortalis-G925 | ||
+ | | MediaTek NPU 890 | ||
+ | | (320 megapixels)<br />Imagiq 1090 | ||
+ | | LPDDR5x quad-channel 16-bit<br />@ 5333 MHz (85.4 GB/s) | ||
+ | | 5G<br />(7000 / 3500 mbps) | ||
+ | | | ||
+ | | "3 nm"<br />TSMC N3E | ||
+ | | 2024/10<ref name="dimensity 9400 release">[https://corp.mediatek.com/news-events/press-releases/mediateks-dimensity-9400-flagship-soc-offers-extreme-performance-and-efficiency-for-the-latest-ai-experiences MediaTek’s Dimensity 9400 Flagship SoC Offers Extreme Performance and Efficiency for the Latest AI Experiences]</ref> | ||
+ | |- | ||
+ | | [[MediaTek Dimensity 9300+|Dimensity 9300+]] | ||
+ | | | ||
+ | * 1x ARM Cortex-X4 @ 3.40 GHz | ||
+ | * 3x ARM Cortex-X4 @ 2.85 GHz | ||
+ | * 4x ARM Cortex-A720 @ 2.0 GHz | ||
+ | | 12x ARM Immortalis-G720 | ||
+ | | MediaTek NPU 790 | ||
+ | | (320 megapixels)<br />Imagiq 990 | ||
+ | | LPDDR5T quad-channel 16-bit<br />@ 4800 MHz (76.7 GB/s) | ||
+ | | 5G<br />(7000 / 3500 mbps) | ||
+ | | MT6989W | ||
+ | | "4 nm"<br />TSMC N4P | ||
+ | | 2024/05<ref name="dimensity 9300plus release">[https://www.prnewswire.com/news-releases/mediatek-boosts-flagship-smartphone-performance-with-dimensity-9300-soc-302137089.html#:~:text=HSINCHU%2C%20May%206%2C%202024%20%2F,chip%20in%20MediaTek's%20Dimensity%20portfolio. MediaTek Boosts Flagship Smartphone Performance with Dimensity 9300+ SoC]</ref> | ||
+ | |- | ||
+ | | [[MediaTek Dimensity 9300|Dimensity 9300]] | ||
+ | | | ||
+ | * 4x ARM Cortex-X4 @ 3.25 GHz | ||
+ | * 4x ARM Cortex-A720 @ 2.0 GHz | ||
+ | | 12x ARM Immortalis-G720 | ||
+ | | MediaTek NPU 790 | ||
+ | | (320 megapixels)<br />Imagiq 990 | ||
+ | | LPDDR5T quad-channel 16-bit<br />@ 4800 MHz (76.7 GB/s) | ||
+ | | 5G<br />(7000 / 3500 mbps) | ||
+ | | MT6989 | ||
+ | | "4 nm"<br />TSMC N4P | ||
+ | | 2023/11<ref name="dimensity 9300 release">[https://corp.mediatek.com/news-events/press-releases/mediateks-new-all-big-core-design-for-flagship-dimensity-9300-chipset-maximizes-smartphone-performance-and-efficiency MediaTek’s New All Big Core Design for Flagship Dimensity 9300 Chipset Maximizes Smartphone Performance and Efficiency]</ref> | ||
+ | |- | ||
|- | |- | ||
| [[MediaTek Dimensity 9200|Dimensity 9200]] | | [[MediaTek Dimensity 9200|Dimensity 9200]] | ||
Line 40: | Line 82: | ||
| "4 nm"<br />TSMC N4 | | "4 nm"<br />TSMC N4 | ||
| 2021/11<ref name="dimensity 9000 release">[https://i.mediatek.com/summit-dimensity9000 Dimensity 9000]</ref> | | 2021/11<ref name="dimensity 9000 release">[https://i.mediatek.com/summit-dimensity9000 Dimensity 9000]</ref> | ||
+ | |- | ||
+ | | [[MediaTek Dimensity 8400|Dimensity 8400]] | ||
+ | | | ||
+ | * 1x ARM Cortex-A725 @ 3.35 GHz | ||
+ | * 3x ARM Cortex-A725 @ 3.0 GHz | ||
+ | * 4x ARM Cortex-A725 @ 2.1 GHz | ||
+ | | 7x ARM Mali-G720 | ||
+ | | MediaTek NPU 880 | ||
+ | | (200 megapixels)<br />Imagiq 1080 | ||
+ | | LPDDR5x quad-channel 16-bit<br />@ 4266 MHz | ||
+ | | 5G<br />(5170 / 2500 mbps) | ||
+ | | MT6899 | ||
+ | | "4 nm"<br />TSMC N4P | ||
+ | | 2024/12<ref name="dimensity 8400 release">[https://corp.mediatek.com/news-events/press-releases/mediatek-unveils-the-dimensity-8400-the-first-all-big-core-chip-for-premium-smartphones MediaTek Unveils the Dimensity 8400, the First All Big Core Chip for Premium Smartphones]</ref> | ||
+ | |- | ||
+ | | [[MediaTek Dimensity 8300|Dimensity 8300]] | ||
+ | | | ||
+ | * 4x ARM Cortex-A715 @ 3.35 GHz | ||
+ | * 4x ARM Cortex-A510 @ 2.2 GHz | ||
+ | | 6x ARM Mali-G615 | ||
+ | | MediaTek APU 780 | ||
+ | | (200 megapixels)<br />Imagiq 980 | ||
+ | | LPDDR5x quad-channel 16-bit<br />@ 4266 MHz | ||
+ | | 5G<br />(5170 / 2500 mbps) | ||
+ | | MT6897 | ||
+ | | "4 nm"<br />TSMC N4P | ||
+ | | 2023/11<ref name="dimensity 8300 release">[https://corp.mediatek.com/news-events/press-releases/mediateks-new-dimensity-8300-chipset-redefines-premium-experiences-in-5g-smartphones MediaTek’s New Dimensity 8300 Chipset Redefines Premium Experiences in 5G Smartphones]</ref> | ||
|- | |- | ||
| [[MediaTek Dimensity 8200|Dimensity 8200]] | | [[MediaTek Dimensity 8200|Dimensity 8200]] | ||
Line 51: | Line 120: | ||
| LPDDR5 quad-channel 16-bit<br />@ 3200 MHz | | LPDDR5 quad-channel 16-bit<br />@ 3200 MHz | ||
| 5G<br />(4700 / 2500 mbps) | | 5G<br />(4700 / 2500 mbps) | ||
− | | | + | | MT6896 |
| "4 nm"<br />TSMC N4 | | "4 nm"<br />TSMC N4 | ||
| 2022/12<ref name="dimensity 8200 release">[https://corp.mediatek.com/news-events/press-releases/mediateks-new-dimensity-8200-upgrades-gaming-experiences-on-premium-5g-smartphones MediaTek’s New Dimensity 8200 Upgrades Gaming Experiences on Premium 5G Smartphones]</ref> | | 2022/12<ref name="dimensity 8200 release">[https://corp.mediatek.com/news-events/press-releases/mediateks-new-dimensity-8200-upgrades-gaming-experiences-on-premium-5g-smartphones MediaTek’s New Dimensity 8200 Upgrades Gaming Experiences on Premium 5G Smartphones]</ref> | ||
Line 64: | Line 133: | ||
| LPDDR5 quad-channel 16-bit<br />@ 3200 MHz | | LPDDR5 quad-channel 16-bit<br />@ 3200 MHz | ||
| 5G<br />(4700 / 2500 mbps) | | 5G<br />(4700 / 2500 mbps) | ||
− | | | + | | MT6895Z |
| "5 nm"<br />TSMC N5 | | "5 nm"<br />TSMC N5 | ||
| 2022/03<ref name="dimensity 8100 8000 1300 release">[https://corp.mediatek.com/news-events/press-releases/mediatek-launches-dimensity-8000-5g-chip-series-for-premium-5g-smartphones MediaTek Launches Dimensity 8000 5G Chip Series for Premium 5G Smartphones]</ref> | | 2022/03<ref name="dimensity 8100 8000 1300 release">[https://corp.mediatek.com/news-events/press-releases/mediatek-launches-dimensity-8000-5g-chip-series-for-premium-5g-smartphones MediaTek Launches Dimensity 8000 5G Chip Series for Premium 5G Smartphones]</ref> | ||
Line 77: | Line 146: | ||
| LPDDR5 quad-channel 16-bit<br />@ 3200 MHz | | LPDDR5 quad-channel 16-bit<br />@ 3200 MHz | ||
| 5G<br />(4700 / 2500 mbps) | | 5G<br />(4700 / 2500 mbps) | ||
− | | | + | | MT6895 |
| "5 nm"<br />TSMC N5 | | "5 nm"<br />TSMC N5 | ||
| 2022/03<ref name="dimensity 8100 8000 1300 release" /> | | 2022/03<ref name="dimensity 8100 8000 1300 release" /> | ||
Line 91: | Line 160: | ||
| LPDDR4x quad-channel 16-bit<br />@ 2133 MHz | | LPDDR4x quad-channel 16-bit<br />@ 2133 MHz | ||
| 5G<br />(4700 / 2500 mbps) | | 5G<br />(4700 / 2500 mbps) | ||
− | | | + | | MT6893Z |
| "6 nm"<br />TSMC N6 | | "6 nm"<br />TSMC N6 | ||
| 2022/03<ref name="dimensity 8100 8000 1300 release" /> | | 2022/03<ref name="dimensity 8100 8000 1300 release" /> | ||
Line 105: | Line 174: | ||
| LPDDR4x quad-channel 16-bit<br />@ 2133 MHz | | LPDDR4x quad-channel 16-bit<br />@ 2133 MHz | ||
| 5G<br />(4700 / 2500 mbps) | | 5G<br />(4700 / 2500 mbps) | ||
− | | | + | | MT6893 |
| "6 nm"<br />TSMC N6 | | "6 nm"<br />TSMC N6 | ||
| 2021/01<ref name="dimensity 1200 release">[https://corp.mediatek.com/news-events/press-releases/mediatek-launches-6nm-dimensity-1200-flagship-5g-soc-with-unrivaled-ai-and-multimedia-for-powerful-5g-experiences MediaTek Launches 6nm Dimensity 1200 Flagship 5G SoC with Unrivaled AI and Multimedia for Powerful 5G Experiences]</ref> | | 2021/01<ref name="dimensity 1200 release">[https://corp.mediatek.com/news-events/press-releases/mediatek-launches-6nm-dimensity-1200-flagship-5g-soc-with-unrivaled-ai-and-multimedia-for-powerful-5g-experiences MediaTek Launches 6nm Dimensity 1200 Flagship 5G SoC with Unrivaled AI and Multimedia for Powerful 5G Experiences]</ref> | ||
Line 118: | Line 187: | ||
| LPDDR4x quad-channel 16-bit<br />@ 2133 MHz | | LPDDR4x quad-channel 16-bit<br />@ 2133 MHz | ||
| 5G<br />(4700 / 2500 mbps) | | 5G<br />(4700 / 2500 mbps) | ||
− | | | + | | MT6891 |
| "6 nm"<br />TSMC N6 | | "6 nm"<br />TSMC N6 | ||
| 2021/01<ref name="dimensity 1200 release" /> | | 2021/01<ref name="dimensity 1200 release" /> | ||
Line 131: | Line 200: | ||
| LPDDR5 quad-channel 16-bit | | LPDDR5 quad-channel 16-bit | ||
| 5G | | 5G | ||
− | | | + | | MT6879 |
| "6 nm"<br />TSMC N6 | | "6 nm"<br />TSMC N6 | ||
| 2022/05<ref name="dimensity 1050 930 g99 release">[https://corp.mediatek.com/news-events/press-releases/mediatek-launches-first-mmwave-chipset-for-seamless-5g-smartphone-connectivity MediaTek Launches First mmWave Chipset for Seamless 5G Smartphone Connectivity]</ref> | | 2022/05<ref name="dimensity 1050 930 g99 release">[https://corp.mediatek.com/news-events/press-releases/mediatek-launches-first-mmwave-chipset-for-seamless-5g-smartphone-connectivity MediaTek Launches First mmWave Chipset for Seamless 5G Smartphone Connectivity]</ref> | ||
Line 170: | Line 239: | ||
| LPDDR4x quad-channel 16-bit<br />@ 1866 MHz (29.9 GB/s) | | LPDDR4x quad-channel 16-bit<br />@ 1866 MHz (29.9 GB/s) | ||
| 5G<br />(2300 / 1200 mbps) | | 5G<br />(2300 / 1200 mbps) | ||
− | | | + | | MT6883Z |
| "7 nm"<br />TSMC N7 | | "7 nm"<br />TSMC N7 | ||
| 2020/09<ref name="dimensity 1000C release">[https://www.mediatek.com/news-events/press-releases/dimensity-5g-chipset-unveiled-for-first-mediatek-powered-5g-smartphone-in-the-united-states Dimensity 5G Chipset Unveiled For First MediaTek Powered 5G Smartphone in the United States]</ref> | | 2020/09<ref name="dimensity 1000C release">[https://www.mediatek.com/news-events/press-releases/dimensity-5g-chipset-unveiled-for-first-mediatek-powered-5g-smartphone-in-the-united-states Dimensity 5G Chipset Unveiled For First MediaTek Powered 5G Smartphone in the United States]</ref> | ||
Line 269: | Line 338: | ||
! Lithography | ! Lithography | ||
! Release date | ! Release date | ||
+ | |- | ||
+ | | [[MediaTek Dimensity 7300|Dimensity 7300]] | ||
+ | | | ||
+ | * 4x ARM Cortex-A78 @ 2.5 GHz | ||
+ | * 4x ARM Cortex-A55 | ||
+ | | 2x ARM Mali-G615 | ||
+ | | MediaTek NPU 655 | ||
+ | | (200 megapixels)<br />MediaTek Imagiq 950 | ||
+ | | LPDDR5-6400 | ||
+ | | 5G<br />(3270 mbps) | ||
+ | | | ||
+ | | "4 nm"<br />TSMC N4 | ||
+ | | 2024/05<ref name="dimensity 7300 release">[https://corp.mediatek.com/news-events/press-releases/mediateks-dimensity-7300-chips-level-up-ai-and-mobile-gaming-for-high-tech-smartphones-and-foldables MediaTek’s Dimensity 7300 Chips Level Up AI and Mobile Gaming for High-Tech Smartphones and Foldables]</ref> | ||
+ | |- | ||
+ | | [[MediaTek Dimensity 7200|Dimensity 7200]] | ||
+ | | | ||
+ | * 2x ARM Cortex-A715 @ 2.8 GHz | ||
+ | * 6x ARM Cortex-A510 | ||
+ | | 4x ARM Mali-G610 | ||
+ | | MediaTek APU 650 | ||
+ | | (200 megapixels)<br />MediaTek Imagiq 765 | ||
+ | | LPDDR5-6400 | ||
+ | | 5G<br />(4700 mbps) | ||
+ | | | ||
+ | | "4 nm"<br />TSMC N4 | ||
+ | | 2023/02<ref name="dimensity 7200 release">[https://corp.mediatek.com/news-events/press-releases/mediatek-launches-dimensity-7200-to-amplify-gaming-and-photography-smartphone-experiences MediaTek Launches Dimensity 7200 to Amplify Gaming and Photography Smartphone Experiences]</ref> | ||
+ | |- | ||
+ | | [[MediaTek Dimensity 7050|Dimensity 7050]] | ||
+ | | | ||
+ | * 2x ARM Cortex-A78 @ 2.6 GHz | ||
+ | * 6x ARM Cortex-A55 @ 2.0 GHz | ||
+ | | 4x ARM Mali-G68 | ||
+ | | MediaTek APU 3.0 | ||
+ | | (200 megapixels)<br />MediaTek Imagiq | ||
+ | | LPDDR5 | ||
+ | | 5G<br />(2770 mbps) | ||
+ | | | ||
+ | | "6 nm"<br />TSMC N6 | ||
+ | | 2023/05<ref name="dimensity 1080 release" /> | ||
|- | |- | ||
| [[MediaTek Dimensity 1080|Dimensity 1080]] | | [[MediaTek Dimensity 1080|Dimensity 1080]] | ||
Line 334: | Line 442: | ||
| "7 nm"<br />TSMC N7 | | "7 nm"<br />TSMC N7 | ||
| 2020/05<ref name="dimensity 820 release">[https://www.mediatek.com/news-events/press-releases/mediateks-new-dimensity-820-chip-brings-incredible-5g-experiences-to-smartphones MediaTek’s New Dimensity 820 Chip Brings Incredible 5G Experiences to Smartphones]</ref> | | 2020/05<ref name="dimensity 820 release">[https://www.mediatek.com/news-events/press-releases/mediateks-new-dimensity-820-chip-brings-incredible-5g-experiences-to-smartphones MediaTek’s New Dimensity 820 Chip Brings Incredible 5G Experiences to Smartphones]</ref> | ||
− | |||
− | |||
− | |||
− | |||
− | |||
− | |||
− | |||
− | |||
− | |||
− | |||
− | |||
− | |||
− | |||
|- | |- | ||
| [[MediaTek Dimensity 800U|Dimensity 800U]] | | [[MediaTek Dimensity 800U|Dimensity 800U]] | ||
Line 606: | Line 701: | ||
! Release date | ! Release date | ||
|- | |- | ||
− | | [[MediaTek Dimensity 700|Dimensity 700]] | + | | [[MediaTek Dimensity 6100+|Dimensity 6300]] |
+ | | | ||
+ | * 2x ARM Cortex-A76 @ 2.4 GHz | ||
+ | * 6x ARM Cortex-A55 @ 2.0 GHz | ||
+ | | 2x ARM Mali-G57 @ 1072 MHz | ||
+ | | | ||
+ | | (108 megapixels) | ||
+ | | LPDDR4x dual-channel 16-bit<br />@ 2133 MHz (17.1 GB/s) | ||
+ | | 5G<br />(2770 mbps) | ||
+ | | MT6835T | ||
+ | | "6 nm"<br />TSMC N6 | ||
+ | | 2024/04<ref name="dimensity 6300 release">[https://www.mediatek.com/tek-talk-blogs/top-6-features-of-the-mediatek-dimensity-6300 Top 6 features of the MediaTek Dimensity 6300]</ref> | ||
+ | |- | ||
+ | | [[MediaTek Dimensity 6100+|Dimensity 6100+]] | ||
+ | | | ||
+ | * 2x ARM Cortex-A76 @ 2.2 GHz | ||
+ | * 6x ARM Cortex-A55 @ 2.0 GHz | ||
+ | | 2x ARM Mali-G57 @ 965 MHz | ||
+ | | | ||
+ | | (108 megapixels) | ||
+ | | LPDDR4x dual-channel 16-bit<br />@ 2133 MHz (17.1 GB/s) | ||
+ | | 5G<br />(2770 mbps) | ||
+ | | MT6835 | ||
+ | | "6 nm"<br />TSMC N6 | ||
+ | | 2023/07<ref name="dimensity 6100 release">[https://www.mediatek.com/tek-talk-blogs/top-6-features-of-the-mediatek-dimensity-6100 Top 6 features of the MediaTek Dimensity 6100+]</ref> | ||
+ | |- | ||
+ | | [[MediaTek Dimensity 810|Dimensity 810]] (6080) | ||
+ | | | ||
+ | * 2x ARM Cortex-A76 @ 2.4 GHz | ||
+ | * 6x ARM Cortex-A55 @ 2.0 GHz | ||
+ | | 2x ARM Mali-G57 | ||
+ | | MediaTek APU 3.0 | ||
+ | | (108 megapixels)<br />MediaTek Imagiq 5.0 | ||
+ | | LPDDR4x-4266 | ||
+ | | 5G | ||
+ | | MT6833P | ||
+ | | "6 nm"<br />TSMC N6 | ||
+ | | 2021/08<ref name="dimensity 920 810 release" /> | ||
+ | |- | ||
+ | | [[MediaTek Dimensity 700|Dimensity 700]] (6020) | ||
| | | | ||
* 2x ARM Cortex-A76 @ 2.2 GHz | * 2x ARM Cortex-A76 @ 2.2 GHz |
Latest revision as of 18:29, 26 December 2024
Contents
Premium
Model | CPU[1] | GPU[2] | DSP[3] | ISP[4] | RAM | Modem | Catalog number | Lithography | Release date |
---|---|---|---|---|---|---|---|---|---|
Dimensity 9400 |
|
12x ARM Immortalis-G925 | MediaTek NPU 890 | (320 megapixels) Imagiq 1090 |
LPDDR5x quad-channel 16-bit @ 5333 MHz (85.4 GB/s) |
5G (7000 / 3500 mbps) |
"3 nm" TSMC N3E |
2024/10[5] | |
Dimensity 9300+ |
|
12x ARM Immortalis-G720 | MediaTek NPU 790 | (320 megapixels) Imagiq 990 |
LPDDR5T quad-channel 16-bit @ 4800 MHz (76.7 GB/s) |
5G (7000 / 3500 mbps) |
MT6989W | "4 nm" TSMC N4P |
2024/05[6] |
Dimensity 9300 |
|
12x ARM Immortalis-G720 | MediaTek NPU 790 | (320 megapixels) Imagiq 990 |
LPDDR5T quad-channel 16-bit @ 4800 MHz (76.7 GB/s) |
5G (7000 / 3500 mbps) |
MT6989 | "4 nm" TSMC N4P |
2023/11[7] |
Dimensity 9200 |
|
11x ARM Immortalis-G715 | MediaTek APU 690 | (320 megapixels) Imagiq 890 |
LPDDR5x quad-channel 16-bit @ 4266 MHz (68.2 GB/s) |
5G (7000 / 2500 mbps) |
"4 nm" TSMC N4 |
2022/11[8] | |
Dimensity 9000 |
|
10x ARM Mali-G710 | MediaTek APU 3.0 | (320 megapixels) Imagiq 790 |
LPDDR5x quad-channel 16-bit @ 3750 MHz (60 GB/s) |
5G (7000 / 2500 mbps) |
"4 nm" TSMC N4 |
2021/11[9] | |
Dimensity 8400 |
|
7x ARM Mali-G720 | MediaTek NPU 880 | (200 megapixels) Imagiq 1080 |
LPDDR5x quad-channel 16-bit @ 4266 MHz |
5G (5170 / 2500 mbps) |
MT6899 | "4 nm" TSMC N4P |
2024/12[10] |
Dimensity 8300 |
|
6x ARM Mali-G615 | MediaTek APU 780 | (200 megapixels) Imagiq 980 |
LPDDR5x quad-channel 16-bit @ 4266 MHz |
5G (5170 / 2500 mbps) |
MT6897 | "4 nm" TSMC N4P |
2023/11[11] |
Dimensity 8200 |
|
6x ARM Mali-G610 | MediaTek APU 580 | (200 megapixels) Imagiq 785 |
LPDDR5 quad-channel 16-bit @ 3200 MHz |
5G (4700 / 2500 mbps) |
MT6896 | "4 nm" TSMC N4 |
2022/12[12] |
Dimensity 8100 |
|
6x ARM Mali-G610 | MediaTek APU 580 | (200 megapixels) Imagiq |
LPDDR5 quad-channel 16-bit @ 3200 MHz |
5G (4700 / 2500 mbps) |
MT6895Z | "5 nm" TSMC N5 |
2022/03[13] |
Dimensity 8000 |
|
6x ARM Mali-G610 | MediaTek APU 580 | (200 megapixels) Imagiq |
LPDDR5 quad-channel 16-bit @ 3200 MHz |
5G (4700 / 2500 mbps) |
MT6895 | "5 nm" TSMC N5 |
2022/03[13] |
Dimensity 1300 |
|
9x ARM Mali-G77 | MediaTek APU 3.0 | (200 megapixels) Imagiq |
LPDDR4x quad-channel 16-bit @ 2133 MHz |
5G (4700 / 2500 mbps) |
MT6893Z | "6 nm" TSMC N6 |
2022/03[13] |
Dimensity 1200 |
|
9x ARM Mali-G77 | MediaTek APU 3.0 | (200 megapixels) Imagiq |
LPDDR4x quad-channel 16-bit @ 2133 MHz |
5G (4700 / 2500 mbps) |
MT6893 | "6 nm" TSMC N6 |
2021/01[14] |
Dimensity 1100 |
|
9x ARM Mali-G77 | MediaTek APU 3.0 | (108 megapixels) Imagiq |
LPDDR4x quad-channel 16-bit @ 2133 MHz |
5G (4700 / 2500 mbps) |
MT6891 | "6 nm" TSMC N6 |
2021/01[14] |
Dimensity 1050 |
|
3x ARM Mali-G610 | MediaTek APU 550 | (108 megapixels) Imagiq 760 |
LPDDR5 quad-channel 16-bit | 5G | MT6879 | "6 nm" TSMC N6 |
2022/05[15] |
Dimensity 1000 |
|
9x ARM Mali-G77 | (4.5 TOPS) MediaTek APU 3.0 |
(80 megapixels) | LPDDR4x quad-channel 16-bit @ 1866 MHz (29.9 GB/s) |
5G (4700 / 2300 mbps) |
MT6889[16] | "7 nm" TSMC N7 |
2019/11[17] |
Dimensity 1000L |
|
7x ARM Mali-G77 @ 695 MHz | MediaTek APU 3.0 | LPDDR4x quad-channel 16-bit @ 1866 MHz (29.9 GB/s) |
5G (4700 / 2300 mbps) |
MT6885Z | "7 nm" TSMC N7 |
2019/11[17] | |
Dimensity 1000C |
|
5x ARM Mali-G57 | MediaTek APU 3.0 | (64 megapixels) | LPDDR4x quad-channel 16-bit @ 1866 MHz (29.9 GB/s) |
5G (2300 / 1200 mbps) |
MT6883Z | "7 nm" TSMC N7 |
2020/09[18] |
Helio X30 |
|
4x PowerVR 7XTP @ 850 MHz | Cadence Tensilica P5 DSP | (28 megapixels) MediaTek Imagiq 2.0 |
LPDDR4x quad-channel 16-bit @ 1866 MHz (29.9 GB/s) |
4G (450 / 150 mbps) |
MT6799 | "10 nm" TSMC 10FF |
2017/02[19] |
Helio X27 |
|
4x ARM Mali-T880 @ 875 MHz | (32 megapixels) MediaTek Imagiq |
LPDDR3 dual-channel 32-bit @ 800 MHz |
4G (300 / 50 mbps) |
MT6797x[20] | "20 nm" TSMC 20 |
2016/12[21] | |
Helio X25 |
|
4x ARM Mali-T880 @ 850 MHz | (32 megapixels) MediaTek Imagiq |
LPDDR3 dual-channel 32-bit @ 800 MHz |
4G (300 / 50 mbps) |
MT6797T[22] | "20 nm" TSMC 20 |
2016/03[23] | |
Helio X23 |
|
4x ARM Mali-T880 @ 800 MHz | (32 megapixels) MediaTek Imagiq |
LPDDR3 dual-channel 32-bit @ 800 MHz |
4G (300 / 50 mbps) |
MT6797D[24] | "20 nm" TSMC 20 |
2016/12[21] | |
Helio X20 |
|
4x ARM Mali-T880 @ 780 MHz | (32 megapixels) MediaTek Imagiq |
LPDDR3 dual-channel 32-bit @ 800 MHz |
4G (300 / 50 mbps) |
MT6797[25] | "20 nm" TSMC 20 |
2015/05[26] | |
Model | CPU | GPU | DSP | ISP | RAM | Modem | Catalog name | Lithography | Release date |
Intermediate
Model | CPU[1] | GPU[2] | DSP[3] | ISP[4] | RAM | Modem | Catalog number | Lithography | Release date |
---|---|---|---|---|---|---|---|---|---|
Dimensity 7300 |
|
2x ARM Mali-G615 | MediaTek NPU 655 | (200 megapixels) MediaTek Imagiq 950 |
LPDDR5-6400 | 5G (3270 mbps) |
"4 nm" TSMC N4 |
2024/05[27] | |
Dimensity 7200 |
|
4x ARM Mali-G610 | MediaTek APU 650 | (200 megapixels) MediaTek Imagiq 765 |
LPDDR5-6400 | 5G (4700 mbps) |
"4 nm" TSMC N4 |
2023/02[28] | |
Dimensity 7050 |
|
4x ARM Mali-G68 | MediaTek APU 3.0 | (200 megapixels) MediaTek Imagiq |
LPDDR5 | 5G (2770 mbps) |
"6 nm" TSMC N6 |
2023/05[29] | |
Dimensity 1080 |
|
4x ARM Mali-G68 | MediaTek APU 3.0 | (200 megapixels) MediaTek Imagiq |
LPDDR5 | 5G (2770 mbps) |
"6 nm" TSMC N6 |
2022/08[29] | |
Dimensity 930 |
|
IMG PowerVR BXM-8-256 | MediaTek APU 3.0 | (108 megapixels) MediaTek Imagiq |
LPDDR5 | 5G (2770 mbps) |
"6 nm" TSMC N6 |
2022/05[15] | |
Dimensity 920 |
|
4x ARM Mali-G68 | MediaTek APU 3.0 | (108 megapixels) MediaTek Imagiq 5.0 |
LPDDR5 | 5G (2770 mbps) |
"6 nm" TSMC N6 |
2021/08[30] | |
Dimensity 900 |
|
2x ARM Mali-G68 | MediaTek APU 3.0 | (108 megapixels) MediaTek Imagiq 5.0 |
LPDDR5 | 5G (2770 mbps) |
"6 nm" TSMC N6 |
2021/05[31] | |
Dimensity 820 |
|
5x ARM Mali-G57 @ 900 MHz | 2.4 TOPS MediaTek APU 3.0 |
(80 megapixels) MediaTek Imagiq 5.0 |
LPDDR4x dual-channel 16-bit @ 2133 MHz (17.1 GB/s) |
5G (2300 / 1200 mbps) |
MT6875 | "7 nm" TSMC N7 |
2020/05[32] |
Dimensity 800U |
|
3x ARM Mali-G57 | 2.4 TOPS MediaTek APU 3.0 |
(64 megapixels) | LPDDR4x dual-channel 16-bit @ 2133 MHz (17.1 GB/s) |
5G (2300 / 1200 mbps) |
MT6853T | "7 nm" TSMC N7 |
2020/08[33] |
Dimensity 800 |
|
4x ARM Mali-G57 | (64 megapixels) | LPDDR4x dual-channel 16-bit @ 2133 MHz (17.1 GB/s) |
5G (2300 / 1200 mbps) |
MT6873 | "7 nm" TSMC N7 |
2020/01[34] | |
Dimensity 720 |
|
3x ARM Mali-G57 | (64 megapixels) | LPDDR4x dual-channel 16-bit @ 2133 MHz (17.1 GB/s) |
5G (2770 mbps) |
MT6853 | "7 nm" TSMC N7 |
2020/07[35] | |
Helio X10 | 8x ARM Cortex-A53 @ 2.0 GHz | PowerVR G6200 @ 700 MHz | (20 megapixels) | LPDDR3 dual-channel 32-bit @ 933 MHz (14.9 GB/s) |
4G (150 / 50 mbps) |
MT6795[36] | "28 nm" TSMC 28HPm |
2014/07[37] | |
Helio G99 |
|
2x ARM Mali-G57 | (108 megapixels) | LPDDR4x dual-channel 32-bit @ 2133 MHz |
4G (600 / 150 mbps) |
"6 nm" TSMC N6 |
2022/05[15] | ||
Helio G96 |
|
2x ARM Mali-G57 | (108 megapixels) | LPDDR4x dual-channel 32-bit @ 2133 MHz |
4G (600 / 150 mbps) |
? | 2021/07[38] | ||
Helio G95 |
|
4x ARM Mali-G76 @ 900 MHz | (64 megapixels) | LPDDR4x dual-channel 32-bit @ 2133 MHz |
4G (600 / 150 mbps) |
"12 nm" TSMC 12FFC |
2020/09[39] | ||
Helio P95 |
|
PowerVR GM9446 @ 970 MHz | (1 TOPs) MediaTek APU 2.0 |
(64 megapixels) | LPDDR4x dual-channel 32-bit @ 1866 MHz |
4G (600 / 150 mbps) |
"12 nm" TSMC 12FFC |
2020/02[40] | |
Helio G90T |
|
4x ARM Mali-G76 @ 800 MHz | (1 TOPs) MediaTek APU 2.0 |
(64 megapixels) | LPDDR4x dual-channel 32-bit @ 2133 MHz |
4G (600 / 150 mbps) |
"12 nm" TSMC 12FFC |
2019/07[41] | |
Helio G90 |
|
4x ARM Mali-G76 @ 720 MHz | (1 TOPs) MediaTek APU 2.0 |
(64 megapixels) | LPDDR4x dual-channel 32-bit @ 2133 MHz |
4G (600 / 150 mbps) |
"12 nm" TSMC 12FFC |
2019/07[41] | |
Helio G88 |
|
2x ARM Mali-G52 @ 1000 MHz | (64 megapixels) | LPDDR4x dual-channel 32-bit @ 1800 MHz |
4G (300 / 150 mbps) |
? | 2021/07[38] | ||
Helio G85 |
|
2x ARM Mali-G52 @ 1000 MHz | (48 megapixels) | LPDDR4x dual-channel 32-bit @ 1800 MHz |
4G (300 / 150 mbps) |
"12 nm" TSMC 12FFC |
2020/05[42] | ||
Helio G80 |
|
2x ARM Mali-G52 @ 950 MHz | (48 megapixels) | LPDDR4x dual-channel 32-bit @ 1800 MHz |
4G (300 / 150 mbps) |
"12 nm" TSMC 12FFC |
2020/02[43] | ||
Helio G70 |
|
2x ARM Mali-G52 @ 820 MHz | (48 megapixels) | LPDDR4x dual-channel 32-bit @ 1800 MHz |
4G (300 / 150 mbps) |
"12 nm" TSMC 12FFC |
2020/02[43] | ||
Helio P90 |
|
PowerVR GM9446 @ 970 MHz | (1 TOPs) MediaTek APU 2.0 |
(64 megapixels) | LPDDR4x dual-channel 32-bit @ 1866 MHz |
4G (600 / 150 mbps) |
MT6779 | "12 nm" TSMC 12FFC |
2018/12[44] |
Helio P70 |
|
3x ARM Mali-G72 @ 900 MHz | MediaTek APU | (48 megapixels) | LPDDR4x dual-channel 32-bit @ 1800 MHz |
4G (300 / 150 mbps) |
MT6771T | "12 nm" TSMC 12FFC |
2018/10[45] |
Helio P65 |
|
2x ARM Mali-G52 @ 820 MHz | MediaTek APU | (48 megapixels) | LPDDR4x dual-channel 32-bit @ 1800 MHz |
4G (300 / 150 mbps) |
MT6768 | "12 nm" TSMC 12FFC |
2019/06[46] |
Helio P60 |
|
3x ARM Mali-G72 @ 800 MHz | MediaTek APU | (32 megapixels) | LPDDR4x dual-channel 32-bit @ 1800 MHz |
4G (300 / 150 mbps) |
MT6771 | "12 nm" TSMC 12FFC |
2018/02[47] |
Model | CPU | GPU | DSP | ISP | RAM | Modem | Catalog name | Lithography | Release date |
Basic
Model | CPU[1] | GPU[2] | DSP[3] | ISP[4] | RAM | Modem | Catalog number | Lithography | Release date |
---|---|---|---|---|---|---|---|---|---|
Dimensity 6300 |
|
2x ARM Mali-G57 @ 1072 MHz | (108 megapixels) | LPDDR4x dual-channel 16-bit @ 2133 MHz (17.1 GB/s) |
5G (2770 mbps) |
MT6835T | "6 nm" TSMC N6 |
2024/04[48] | |
Dimensity 6100+ |
|
2x ARM Mali-G57 @ 965 MHz | (108 megapixels) | LPDDR4x dual-channel 16-bit @ 2133 MHz (17.1 GB/s) |
5G (2770 mbps) |
MT6835 | "6 nm" TSMC N6 |
2023/07[49] | |
Dimensity 810 (6080) |
|
2x ARM Mali-G57 | MediaTek APU 3.0 | (108 megapixels) MediaTek Imagiq 5.0 |
LPDDR4x-4266 | 5G | MT6833P | "6 nm" TSMC N6 |
2021/08[30] |
Dimensity 700 (6020) |
|
2x ARM Mali-G57 @ 950 MHz | (64 megapixels) | LPDDR4x dual-channel 16-bit @ 2133 MHz (17.1 GB/s) |
5G (2770 mbps) |
"7 nm" TSMC N7 |
2020/11[50] | ||
Helio G35 | 8x ARM Cortex-A53 @ 2.3 GHz | PowerVR GE8320 @ 680 MHz | (25 megapixels) | LPDDR4x dual-channel 32-bit @ 1600 MHz |
4G (300 / 150 mbps) |
MT6765 | "12 nm" TSMC 12FFC |
2020/06[51] | |
Helio P35 | 8x ARM Cortex-A53 @ 2.3 GHz | PowerVR GE8320 @ 680 MHz | Cadence Tensilica Vision P5 DSP @ 500 MHz | (25 megapixels) MediaTek Imagiq |
LPDDR4x dual-channel 16-bit @ 1600 MHz |
4G (300 / 150 mbps) |
"12 nm" TSMC 12FFC |
2018/12[52] | |
Helio P30 |
|
2x ARM Mali-G71 @ 950 MHz | Cadence Tensilica Vision P5 DSP @ 500 MHz | (25 megapixels) MediaTek Imagiq 2.0 |
LPDDR4x dual-channel 16-bit @ 1600 MHz |
4G (300 / 150 mbps) |
"16 nm" TSMC 16FF+ |
2018/12[53] | |
Helio G25 | 8x ARM Cortex-A53 @ 2.0 GHz | PowerVR GE8320 @ 650 MHz | (21 megapixels) | LPDDR4x dual-channel 16-bit @ 1600 MHz |
4G (300 / 150 mbps) |
"12 nm" TSMC 12FFC |
2020/06[51] | ||
Helio P25 |
|
2x ARM Mali-T880 @ 1000 MHz | (24 megapixels) MediaTek Imagiq |
LPDDR4x dual-channel 16-bit @ 1600 MHz (12.8 GB/s) |
4G (300 / 150 mbps) |
"16 nm" TSMC 16FF+ |
2017/02[54] | ||
Helio P23 |
|
2x ARM Mali-G71 @ 770 MHz | (24 megapixels) MediaTek Imagiq 2.0 |
LPDDR4x dual-channel 16-bit @ 1500 MHz |
4G (300 / 150 mbps) |
MT6763T | "16 nm" TSMC 16FF+ |
2018/12[53] | |
Helio P22 |
|
PowerVR GE8320 @ 650 MHz | (21 megapixels) MediaTek Imagiq |
LPDDR4x dual-channel 16-bit @ 1600 MHz |
4G (300 / 150 mbps) |
MT6762 | "12 nm" TSMC 12FFC |
2018/05[55] | |
Helio P20 |
|
2x ARM Mali-T880 @ 900 MHz | (24 megapixels) MediaTek Imagiq |
LPDDR4x dual-channel 16-bit @ 1600 MHz (12.8 GB/s) |
4G (300 / 150 mbps) |
MT6757 | "16 nm" TSMC 16FF+ |
2016/02[56] | |
Helio P18 |
|
2x ARM Mali-T860 @ 800 MHz | (21 megapixels) | LPDDR3 single-channel 32-bit @ 933 MHz (7.4 GB/s) |
4G (300 / 150 mbps) |
MT6755S[57] | "28 nm" TSMC 28HPC+ |
2018/05[58] | |
Helio P15 |
|
2x ARM Mali-T860 @ 700 MHz | (21 megapixels) | LPDDR3 single-channel 32-bit @ 933 MHz (7.4 GB/s) |
4G (300 / 150 mbps) |
MT6755T | "28 nm" TSMC 28HPC+ |
2016/10[59] | |
Helio P10 |
|
2x ARM Mali-T860 @ 700 MHz | (21 megapixels) | LPDDR3 single-channel 32-bit @ 933 MHz (7.4 GB/s) |
4G (300 / 150 mbps) |
MT6755[60] | "28 nm" TSMC 28HPC+ |
2015/06[61] | |
Helio A25 |
|
PowerVR GE8320 @ 600 MHz | (16 megapixels) | LPDDR4x dual-channel 32-bit @ 1600 MHz |
4G (300 / 150 mbps) |
"12 nm" TSMC 12FFC |
2020/03 | ||
Helio A22 |
|
PowerVR GE8300 @ 660 MHz | (21 megapixels) | LPDDR4x dual-channel 32-bit @ 1600 MHz |
4G (300 / 150 mbps) |
"12 nm" TSMC 12FFC |
2018/06[62] | ||
Helio A20 |
|
PowerVR GE8300 @ 550 MHz | (16 megapixels) | LPDDR4 dual-channel 32-bit @ 1200 MHz |
4G (300 / 150 mbps) |
"12 nm" TSMC 12FFC |
2020/01[63] | ||
MT6739 |
|
PowerVR GE8100 @ 570 MHz | (13 megapixels) | LPDDR3 single-channel 32-bit @ 667 MHz (6.4 GB/s) |
4G (150 / 50 mbps) |
"28 nm" TSMC 28HPm |
2017/09[64] | ||
Model | CPU | GPU | DSP | ISP | RAM | Modem | Catalog name | Lithography | Release date |
PC & tablet processors
Model | CPU[1] | GPU[2] | DSP[3] | ISP[4] | RAM | Modem | Catalog number | Lithography | Release date |
---|---|---|---|---|---|---|---|---|---|
Kompanio 1300T |
|
9x ARM Mali-G77 | MediaTek APU 3.0 |
(108 megapixels) | LPDDR4x quad-channel 16-bit @ 2133 MHz (34.2 GB/s) |
5G (4700 / 2500 mbps) |
"6 nm" TSMC N6 |
2021/07[65] | |
Kompanio 1200 |
|
5x ARM Mali-G57 | (4 TOPS) MediaTek APU 3.0 |
(80 megapixels) | LPDDR4x quad-channel 16-bit @ 2133 MHz (34.2 GB/s) |
n/a | MT8195 | "6 nm" TSMC N6 |
2020/11[66] |
Kompanio 900T |
|
4x ARM Mali-G68 | (2.4 TOPS) MediaTek APU 2.0 |
(108 megapixels) | LPDDR4x dual-channel 16-bit @ 2133 MHz (17.1 GB/s) |
5G | "6 nm" TSMC N6 |
2021/09[67] | |
Kompanio 820 |
|
5x ARM Mali-G57 | (2.4 TOPS) MediaTek APU 2.0 |
(32 megapixels) | LPDDR4x dual-channel 16-bit @ 2133 MHz (17.1 GB/s) |
n/a | MT8192 | "7 nm" TSMC N7 |
2020/11[66] |
Kompanio 500 Helio P60T |
|
3x ARM Mali-G72 @ 800 MHz | (0.5 TOPS) MediaTek APU |
(32 megapixels) | LPDDR4x | n/a | MT8183[68] | "12 nm" TSMC 12FFC |
2019/11[69] |
MT8788 |
|
3x ARM Mali-G72 @ 800 MHz | (32 megapixels) | LPDDR4x dual-channel 16-bit @ 1800 MHz |
4G (300 / 150) | 2017 | |||
MT8785 |
|
2x ARM Mali-T820 @ 700 MHz | (21 megapixels) | LPDDR3 single-channel @ 933 MHz |
4G (150 / 50) | "28 nm" TSMC 28HPm |
2017/03[70] | ||
MT8783 |
|
3x ARM Mali-T720 @ 700 MHz | (16 megapixels) | LPDDR3 dual-channel @ 933 MHz |
4G (150 / 50) | "28 nm" TSMC 28HPm |
2015 | ||
MT8768 |
|
PowerVR GE8320 | (25 megapixels) | LPDDR4x | 4G (300 / 150) | 2020/05 | |||
MT8766 |
|
PowerVR GE8300 | (21 megapixels) | LPDDR4x | 4G (150 / 75) | ||||
MT8735 |
|
2x ARM Mali-T720 | (13/8 megapixels) | LPDDR3 | 4G (150 / 50) | "28 nm" TSMC 28HPm |
2015/04[71] | ||
MT8321 |
|
ARM Mali-400 | (8 megapixels) | LPDDR3 | 3G | "28 nm" TSMC 28HPm |
2014 | ||
MT8176 |
|
PowerVR GX6250 @ 600 MHz | (20 megapixels) | LPDDR3 dual-channel | n/a | "28 nm" TSMC 28HPm |
2016/08[72] | ||
MT8175 |
|
1x ARM Mali-G52 | MediaTek APU | (13 megapixels) | LPDDR4x | n/a | 2019/01[73] | ||
MT8173 |
|
PowerVR GX6250 @ 700 MHz | (20 megapixels) | LPDDR3 dual-channel @ 933 MHz |
n/a | "28 nm" TSMC 28HPm |
2015/03[74] | ||
MT8168 |
|
1x ARM Mali-G52 @ 800 MHz | (13 megapixels) | LPDDR4x | n/a | "12 nm" TSMC 12FF |
2020/05[75] | ||
MT8167 |
|
PowerVR GE8300 | (8 megapixels) | DDR4 | n/a | "28 nm" TSMC 28HPm |
2017 | ||
MT8163 |
|
2x ARM Mali-T720 @ 600 MHz | (13 megapixels) | DDR3 @ 800 MHz | n/a | "28 nm" TSMC 28HPm |
2015/04[71] | ||
MT8135 |
|
PowerVR G6200 @ 450 MHz | DDR3 | n/a | "28 nm" TSMC 28HPm |
2013/07[76] | |||
MT8127 |
|
4x ARM Mali-450 @ 600 MHz | (13 megapixels) | DDR3 @ 666 MHz (5.3 GB/s) | n/a | "28 nm" TSMC 28HPm |
2014/05[77] | ||
Model | CPU | GPU | DSP | ISP | RAM | Modem | Catalog name | Lithography | Release date |
TV / media player processors
Model | CPU[1] | GPU[2] | DSP[3] | ISP[4] | RAM | Modem | Catalog number | Lithography | Release date |
---|---|---|---|---|---|---|---|---|---|
S900 |
|
2x ARM Mali-G52 @ 800 MHz | (1.6 TOPS) MediaTek APU |
n/a | LPDDR4 @ 1850 MHz | n/a | MT9950[78] | 2019/07[79] | |
MT9613 |
|
1x ARM Mali-G52 @ 800 MHz | (1.0 TOPS) MediaTek APU |
n/a | n/a | ||||
MT9612 |
|
1x ARM Mali-G52 | n/a | DDR3 | n/a | ||||
MT9611 |
|
2x ARM Mali-G52 | n/a | DDR3 | n/a | 2021/02[80] | |||
MT9602 |
|
1x ARM Mali-G52 @ 850 MHz | n/a | DDR3 | n/a | 2020/11?[81] | |||
MT8696 |
|
PowerVR GE9215 @ 750 MHz | n/a | DDR4 | n/a | 2021/09[82] | |||
MT8695 |
|
PowerVR GE8300 | n/a | DDR4 | n/a | "12 nm" TSMC 12 |
2018/01[83] | ||
MT8693 |
|
PowerVR GX6250 | (0.5 TOPS) MediaTek APU |
n/a | LPDDR3 dual-channel | n/a | "28 nm" TSMC 28HPm |
2016/03? | |
MT5597 |
|
ARM Mali | n/a | n/a | 2017/06[84] | ||||
MT5596 |
|
2x ARM Mali-T860 | n/a | n/a | 2016/01[85] | ||||
MT5592 |
|
PowerVR SGX543 | n/a | n/a | |||||
MT5582 |
|
ARM Mali | n/a | n/a | |||||
Model | CPU | GPU | DSP | ISP | RAM | Modem | Catalog name | Lithography | Release date |
See also
References
- ↑ 1.0 1.1 1.2 1.3 1.4 Central Processing Unit.
- ↑ 2.0 2.1 2.2 2.3 2.4 Graphics Processing Unit, responsible for displaying graphics and text on the device screen.
- ↑ 3.0 3.1 3.2 3.3 3.4 Digital Signal Processor, responsible for measuring, filtering and compressing analog signals.
- ↑ 4.0 4.1 4.2 4.3 4.4 Image Signal Processor, responsible for processing the images captured by the camera.
- ↑ MediaTek’s Dimensity 9400 Flagship SoC Offers Extreme Performance and Efficiency for the Latest AI Experiences
- ↑ MediaTek Boosts Flagship Smartphone Performance with Dimensity 9300+ SoC
- ↑ MediaTek’s New All Big Core Design for Flagship Dimensity 9300 Chipset Maximizes Smartphone Performance and Efficiency
- ↑ MediaTek Launches Flagship Dimensity 9200 Chipset for Incredible Performance and Unmatched Power Savings
- ↑ Dimensity 9000
- ↑ MediaTek Unveils the Dimensity 8400, the First All Big Core Chip for Premium Smartphones
- ↑ MediaTek’s New Dimensity 8300 Chipset Redefines Premium Experiences in 5G Smartphones
- ↑ MediaTek’s New Dimensity 8200 Upgrades Gaming Experiences on Premium 5G Smartphones
- ↑ 13.0 13.1 13.2 MediaTek Launches Dimensity 8000 5G Chip Series for Premium 5G Smartphones
- ↑ 14.0 14.1 MediaTek Launches 6nm Dimensity 1200 Flagship 5G SoC with Unrivaled AI and Multimedia for Powerful 5G Experiences
- ↑ 15.0 15.1 15.2 MediaTek Launches First mmWave Chipset for Seamless 5G Smartphone Connectivity
- ↑ MediaTek Dimensity 1000 tops Antutu performance
- ↑ 17.0 17.1 MediaTek Announces Dimensity, World’s Most Advanced 5G Chipset Family, & Dimensity 1000 5G SoC
- ↑ Dimensity 5G Chipset Unveiled For First MediaTek Powered 5G Smartphone in the United States
- ↑ MediaTek Unveils Helio X30 to Power Premium Mobile Experiences
- ↑ MediaTek Helio X27
- ↑ 21.0 21.1 MediaTek Helio X23 & X27 Set New Benchmark in User Experience
- ↑ MediaTek Helio X25
- ↑ MediaTek's 10-core mobile chip hits the market next month
- ↑ MediaTek Helio X23
- ↑ MediaTek Helio X20
- ↑ MediaTek Launches the MediaTek Helio™ X20: The World’s First Mobile SoC Featuring Tri-Cluster™ CPU Architecture
- ↑ MediaTek’s Dimensity 7300 Chips Level Up AI and Mobile Gaming for High-Tech Smartphones and Foldables
- ↑ MediaTek Launches Dimensity 7200 to Amplify Gaming and Photography Smartphone Experiences
- ↑ 29.0 29.1 MediaTek’s New Dimensity 1080 Brings a Performance Boost to 5G Smartphones
- ↑ 30.0 30.1 MediaTek Announces Dimensity 920 and Dimensity 810 Chips for 5G Smartphones
- ↑ MediaTek Brings Premium Features to High Tier 5G Smartphones with New 6nm Dimensity 900 5G Chipset
- ↑ MediaTek’s New Dimensity 820 Chip Brings Incredible 5G Experiences to Smartphones
- ↑ MediaTek Introduces Newest 5G SoC, Dimensity 800U for Ultra Connectivity and Advanced 5G Dual SIM Technology
- ↑ MediaTek Announces Dimensity 800 5G Series Chipsets for New Premium 5G Smartphones
- ↑ MediaTek Announces Dimensity 720, its Newest 5G Chip For Premium 5G Experiences on Mid-Tier Smartphones
- ↑ MediaTek Helio X10
- ↑ MediaTek Launches 64-bit True Octa-core™ LTE Smartphone SoC with World’s First 2K Display Support
- ↑ 38.0 38.1 MediaTek Launches Helio G96 and Helio G88 SoCs Bringing Advanced Display and Photography Capabilities to Premium Smartphones
- ↑ MediaTek Unveils Helio G95, its Newest Chip for Premium 4G Gaming Smartphones
- ↑ The MediaTek Helio P95 Infographic
- ↑ 41.0 41.1 MediaTek Introduces New Helio G Series Chipsets – Helio G90 & G90T – And HyperEngine Game Technology to Power Incredible Smartphone Gaming Experiences
- ↑ MediaTek Unveils Newest Addition to Gaming Chipset Series with Helio G85
- ↑ 43.0 43.1 MediaTek Launches Newest Gaming Series Chipsets – Helio G70 & G80 – With Enhanced HyperEngine Technology for Superior Smartphone Gaming Experiences
- ↑ MediaTek’s Helio P90 Is an AI Powerhouse for a New Level of AI Experiences and High Resolution Smartphone Photography
- ↑ MediaTek’s Helio P70 Brings Advanced AI and Premium Upgrades To Mid-Range Devices
- ↑ MediaTek Releases Powerful Helio P65 Chip for Smartphones
- ↑ MediaTek Powers the Future of Mobile with New Helio P60 Chipset, Bringing Big Core Power & AI Experiences to Consumers
- ↑ Top 6 features of the MediaTek Dimensity 6300
- ↑ Top 6 features of the MediaTek Dimensity 6100+
- ↑ MediaTek Unveils Its Newest 5G Chipset, Dimensity 700, For Mass Market 5G Smartphones
- ↑ 51.0 51.1 MediaTek Introduces Helio G35 & G25 Gaming Series Chipsets
- ↑ 7 reasons the Helio P35 should power your next smartphone
- ↑ 53.0 53.1 New MediaTek Helio Chipsets Deliver Rich Features to Booming Mid-Range Market
- ↑ MediaTek Introduces Helio P25 Premium Performance Chip For Dual-Camera Smartphones
- ↑ MediaTek Unveils New Helio P22 Chipset to Power Mid-Range “New Premium” Smartphones
- ↑ MediaTek Introduces the MediaTek Helio P20 as Newest Addition to its Premium Mobile Processor Family
- ↑ MediaTek Helio P18
- ↑ Nokia 5.1 and 3.1 unveiled with tall screens, new chipsets, Nokia 2.1 tags along
- ↑ MediaTek announces Helio P15 chipset
- ↑ MediaTek Helio P10
- ↑ MediaTek Expands its Flagship MediaTek Helio™ Processor Family with the P Series, Offering Premium Performance for Super Slim Designs
- ↑ Xiaomi Redmi 6A powered by MediaTek Helio A22
- ↑ Ruggedized Cat S32 Smartphone powered by MediaTek Helio A20
- ↑ Full-Featured MediaTek Smartphone Chipset MT6739 Debuts in India
- ↑ MediaTek Introduces the Kompanio 1300T Platform to Enhance Premium Computing Experiences in Tablets
- ↑ 66.0 66.1 MediaTek Announces New MT8192 and MT8195 Chipsets Designed for Next Generation of Chromebooks
- ↑ MediaTek Announces Kompanio 900T to Enhance Computing Experiences for Tablets and Notebooks
- ↑ Media love the Lenovo Chromebook Duet, powered by MediaTek
- ↑ Amazon Fire HD 10 tablet is powered by MediaTek
- ↑ MT8785 - Cat-6 enabled octa-core tablet chipset
- ↑ 71.0 71.1 MediaTek unveils 64-bit MT8163 and MT8735 chips for tablets
- ↑ New MediaTek SoC Selected to Power ASUS ZenPad Tablet
- ↑ MediaTek Furthers Edge AI Leadership with New AI Enhancements for Smart TVs, Displays, Cameras and Speakers
- ↑ MediaTek To Redefine the Android Tablet Industry with world-first ARM® Cortex®-A72-based tablet SoC – MT8173
- ↑ Amazon launches Fire HD 8 tablet powered by MediaTek
- ↑ MediaTek Introduces Industry Leading Tablet SoC, MT8135
- ↑ MediaTek Announces MT8127 System on Chip with HEVC Video Playback Support for Quad-core Tablets
- ↑ MediaTek S900 (MT9950)
- ↑ MediaTek Launches S900 Globally to Power 8K Smart TVs
- ↑ XIAOMI UNVEILS ITS PREMIUM QLED TV FOR VIBRANT, HIGH-QUALITY ENTERTAINMENT
- ↑ Motorola Revou Series Smart TV, powered by MediaTek
- ↑ Introducing the next generation Fire TV Stick 4K Max and Amazon’s first smart TV
- ↑ MediaTek Evolves its Home Entertainment Platform to Support Artificial Intelligence Driven Smart Home Devices
- ↑ MediaTek Announces Ultra HD TV SoC Supporting Dolby Vision and Hybrid Log Gamma (HLG)
- ↑ MediaTek introduces the new MT5596, MT8581 and MT7697 for smart TV and the Internet of Things
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